An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Haque, S.; Xing, Kun; Lin, Ray-Lee; Suchicital, Carlos; Lü, Gongxuan; Nelson, Douglas; Borojevic, D.; Lee, F.C.

doi:10.1109/6040.763184

Cited by 65 publications

(15 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These hot spots are also areas of high temporal thermal gradients when power is rapidly switched on and off. Lastly, wire-bonded modules have a low power density and a low silicon-to-footprint ratio due to their packaging structure [85].…”

Section: Figure 13mentioning

confidence: 99%

Power Modulation Investigation for High Temperature (175-200 degrees Celcius) Automotive Application

McCluskey¹

2007

View full text Add to dashboard Cite

Section: Figure 13mentioning

confidence: 99%

Power Modulation Investigation for High Temperature (175-200 degrees Celcius) Automotive Application

McCluskey¹

2007

View full text Add to dashboard Cite

“…A fin heat sink was used for heat removal. The metal post interconnected parallel plate structure (MPIPPS) module design was part of the power electronic building block (PEBB) initiative at Virginia Tech [57,58]. A 15 kW inverter was constructed that was capable of switching at 20 kHz, at least twice as fast as the switching speed achieved using a comparable wire bonded device.…”

Section: D Integration Effortsmentioning

confidence: 99%

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Seal

Mantooth

2017

Energies

View full text Add to dashboard Cite

This paper presents a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered these advancements, the major technology barriers preventing SiC power devices from performing to their fullest ability were identified. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were described, and the concept for a novel SiC power module was discussed.

show abstract

“…To increase current capability, a number of parallel bonding wires are often used, approaching a discretized planar conductor. Planar connections to the chips have recently been introduced, since this leads to advantages in interconnection technology [21], [22]. The assemblies of power semiconductors in the modules occupy a fair amount of surface due to heat spreading considerations.…”

Section: Electromagnetic Transients On the Switchesmentioning

confidence: 99%

Electromagnetic energy propagation in power electronic converters: toward future electromagnetic integration

Ferreira

Wyk

2001

Proc. IEEE

View full text Add to dashboard Cite

I. POWER ELECTRONICS TOWARD ELECTROMAGNETIC ENERGY PROCESSING A. Shrinking Dimensions and Increasing FrequencyStudying the historical development of power electronics [1], [2] indicates that for a long time after its inception, a discrete, decoupled approach to modeling, design, and construction of power electronic converters was totally adequate. Electrical, thermal, and mechanical modeling and design was decoupled, while the sequential type of manufacturing in use was based on using separate components and after laying them out on a plane, wiring them together. This approach had a convenient, almost one-to-one correspondence to the lumped element circuit modeling, using ideal component transfer functions. This discrete, sequential thinking has permeated research, development, design methodology, and teaching to the present. Even hybrid, integrated power electronics modules are still constructed in a quasi-discrete way. However, continuing change in power device technology, a continuing increase in power density and/or frequency [3], [4] over the past decades have resulted in close electromagnetic, thermal, and mechanical coupling of all the "components" and interconnections that comprise the converter, accentuating undesirable side effects due to the close proximity of "components," materials used, interconnections necessary, etc. ("parasitics"). As the tendency toward integration of modules for the future continues, the integrated power processor is approaching (see Fig. 1), signaling the necessity for change in the present methodology for analysis and design. B. The Integrated Power Processor as Electromagnetic DeviceAt present, a power electronic converter may be characterized as a spread-out electromagnetic device. The quest for increased power density continues the reduction in dimensions and the tendency toward physical integration. This will eventually make the electromagnetic coupling between different subsections of the converter, the electromagnetic nature of inter-and intraconnections, and the electromagnetic nature of the switching processes dominant for determining the energy processing transfer function. For this eventual electromagnetic energy processor, it follows that the electromagnetic limits will be dominant and will have to be explored. As an aid to analyze this development of power electronics technology, the different fundamental functions performed in a converter had been defined in previous work [5]. This analysis did not include the thermal and mechanical functions and

show abstract

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Cited by 65 publications

References 4 publications

Power Modulation Investigation for High Temperature (175-200 degrees Celcius) Automotive Application

Power Modulation Investigation for High Temperature (175-200 degrees Celcius) Automotive Application

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Electromagnetic energy propagation in power electronic converters: toward future electromagnetic integration

Contact Info

Product

Resources

About