2013
DOI: 10.1109/tap.2013.2282708
|View full text |Cite
|
Sign up to set email alerts
|

An Integrated 122-GHz Antenna Array With Wire Bond Compensation for SMT Radar Sensors

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
15
0

Year Published

2014
2014
2023
2023

Publication Types

Select...
4
3
2

Relationship

2
7

Authors

Journals

citations
Cited by 43 publications
(16 citation statements)
references
References 26 publications
0
15
0
Order By: Relevance
“…A sheet-like waveguide (free access mat) that is easy to manufacture and can excite the waveguide with an arbitrary antenna has been proposed [23]. In this paper, we describe the electromagnetically coupled ribbon wire interconnect used to cross the line which becomes the basis of this waveguide [24]. We describe the characteristics of one -dimensional and two -dimensional line using this structure.…”
Section: Introductionmentioning
confidence: 99%
“…A sheet-like waveguide (free access mat) that is easy to manufacture and can excite the waveguide with an arbitrary antenna has been proposed [23]. In this paper, we describe the electromagnetically coupled ribbon wire interconnect used to cross the line which becomes the basis of this waveguide [24]. We describe the characteristics of one -dimensional and two -dimensional line using this structure.…”
Section: Introductionmentioning
confidence: 99%
“…That is the reason why the usage of this antenna type is especially interesting for integrated millimeter-wave (mmW) radars. At high center frequencies the antennas become small enough to make packaging solutions similar to the one presented in [3] possible. Also, feeding with a group of surface wave launchers gives the possibility to expand the beamforming in a second dimension [4].…”
Section: Introductionmentioning
confidence: 99%
“…The idea of the EU funded project SUCCESS [20] is the realization of a complete RF radar frontend on a single chip combined with high efficient off-chip antennas [13], [14], [15] since the directivity and efficiency of on-chip antennas is in general limited due to the high permittivity semiconductor substrates [9]. A low-cost packaging solution is aspired by using standard QFN packages [16], [17], [18], [19] for the complete System in Package approach in which no RF signals have to be routed through the lead frame of the package.…”
Section: Introductionmentioning
confidence: 99%
“…A low-cost packaging solution is aspired by using standard QFN packages [16], [17], [18], [19] for the complete System in Package approach in which no RF signals have to be routed through the lead frame of the package. By using a flipchip or compensated bond-wire technology [10], [12], [13] for the chip-antenna interconnect, this low-cost package becomes an attractive solution also for millimeter-wave systems above 100 GHz. There are many other research groups investigating packaging solutions at this frequency ranges since the package design becomes a challenging task in realizing millimeter wave frontends.…”
Section: Introductionmentioning
confidence: 99%