2016
DOI: 10.1016/j.applthermaleng.2016.06.140
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An integrated hardware-in-the-loop verification approach for dual heat sink systems of aerospace single phase mechanically pumped fluid loop

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Cited by 21 publications
(4 citation statements)
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“…Model of Thermal Well Figure 4c illustrates individual temperature points of the heat well. The temperature dynamics of the inner pipe and outer pipe of the thermal well, which are based on the energy conservation principle, are represented by Equations (7)-(8) [31,37]:…”
Section: Model Of Burnermentioning
confidence: 99%
“…Model of Thermal Well Figure 4c illustrates individual temperature points of the heat well. The temperature dynamics of the inner pipe and outer pipe of the thermal well, which are based on the energy conservation principle, are represented by Equations (7)-(8) [31,37]:…”
Section: Model Of Burnermentioning
confidence: 99%
“…All the flow resistances in the NBCS are composed of two kinds of flow resistances, which are local flow resistance and friction flow resistance [ 35 ]. The expressions of local flow resistance and friction loss flow resistance are given in Equations (12) and (13), as follows.…”
Section: Idea Of Nanofluid-based Cooling System and Mathematic Modmentioning
confidence: 99%
“…Thus, effective thermal control, specifically the mitigation of temperature fluctuations and the maintenance of stable temperature levels over extended periods, are recognized as an urgent issue in the study of transient high-heat-flow-density electronic devices. The conventional thermal management systems for electronic devices in cabin employ single-phase or two-phase liquid circuits [6,7], with the heat sink playing a crucial role in temperature regulation by absorbing heat from the electronic components to prevent temperature elevation and fluctuations. However, pulsed devices such as radar and processor chips discussed in this paper, present unique characteristics including short peak power durations, significant heat loss during transients, and less heat dissipation requirements during the remaining operating periods.…”
Section: Introductionmentioning
confidence: 99%
“…In this context, it is contended that distinct advantages are offered by PCMs, such as high thermal capacity, isothermal or nearly isothermal behavior during phase changes, excellent stability, and reusability. By leveraging these properties, the absorption of thermal shock from the heat source and the The conventional thermal management systems for electronic devices in cabin employ single-phase or two-phase liquid circuits [6,7], with the heat sink playing a crucial role in temperature regulation by absorbing heat from the electronic components to prevent temperature elevation and fluctuations. However, pulsed devices such as radar and processor chips discussed in this paper, present unique characteristics including short peak power durations, significant heat loss during transients, and less heat dissipation requirements during the remaining operating periods.…”
Section: Introductionmentioning
confidence: 99%