An investigation of corrosion on integrated circuits via pressure-temperature-humidity-bias stressing

VanOverloop, D.

doi:10.1109/24.52630

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Cited by 8 publications

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“…0026 High temperature, humidity, and pressure are also important factors to consider in designing reliable microcontrollers and digital systems. Sandia National Laboratories investigated a technique to measure mechanical stress over the surface of an integrated circuit during the molding process [8]. These measurements were used to optimize mold geometry during the manufacturing process.…”

Section: Introductionmentioning

confidence: 99%