2017
DOI: 10.1088/1674-1056/26/8/088503
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An investigation of ionizing radiation damage in different SiGe processes

Abstract: Different SiGe processes and device designs are the critical influences of ionizing radiation damage. Based on the different ionizing radiation damage in SiGe HBTs fabricated by Huajie and an IBM SiGe process, quantitatively numerical simulation of ionizing radiation damage was carried out to explicate the distribution of radiation-induced charges buildup in KT9041 and IBM SiGe HBTs. The sensitive areas of the EB-spacer and isolation oxide of KT9041 are much larger than those of the IBM SiGe HBT, and the distr… Show more

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Cited by 7 publications
(2 citation statements)
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“…To our knowledge, although some research groups have employed first principles calculation within the framework of DFT to study the physical properties of Au-Ag alloy and the microscopic behaviors of He defects, few reports have paid attention to the molecular dynamics (MD) simulation [18][19][20][21][22] for He behavior in Au-Ag alloy. In this work, we employ MD method on basis of embedded atom method (EAM) to analyze the physical properties and He behaviors in Au and Ag metal, which can be useful for understanding He point defects in Au-Ag alloy, even δ phase Pu-Ga alloy.…”
Section: Introductionmentioning
confidence: 99%
“…To our knowledge, although some research groups have employed first principles calculation within the framework of DFT to study the physical properties of Au-Ag alloy and the microscopic behaviors of He defects, few reports have paid attention to the molecular dynamics (MD) simulation [18][19][20][21][22] for He behavior in Au-Ag alloy. In this work, we employ MD method on basis of embedded atom method (EAM) to analyze the physical properties and He behaviors in Au and Ag metal, which can be useful for understanding He point defects in Au-Ag alloy, even δ phase Pu-Ga alloy.…”
Section: Introductionmentioning
confidence: 99%
“…The influence of HPM on modern semiconductor devices and circuit systems has received increasing attention. [2][3][4][5][6][7][8][9][10][11][12] A simulation of a bipolar junction transistor (BJT) with the high electromagnetic pulses injection from the collector was simulated by utilizing the finite difference time domain method in two dimensions, the results indicated that the damage spot lay between the emitter and the collector where the avalanche breakdown occurs. [13] The transient response characteristics were simulated using the improver two-dimensional semiconductor device simulation program in order to obtain the damage effect of the BJT under the injection of electromagnetic pulse, which showed that the peak temperature appears on the edge of the emitter.…”
Section: Introductionmentioning
confidence: 99%