2000
DOI: 10.1115/1.1286471
|View full text |Cite
|
Sign up to set email alerts
|

An Investigation of Material Removal Mechanisms in Lapping with Grain Size Transition

Abstract: The mechanical material removal (MRR) mechanisms in lapping were investigated, using concepts of two-body vs. three-body abrasion and ductile vs. brittle machining. The statistical nature of the depth of cut in the lapping process was described using distribution of abrasive sizes in the slurry. Through the change in abrasive size distribution, the time dependent characteristic of MRR was captured in the model. Experiments were conducted for model verification. It was found that a constant 60 deg effective inc… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

2
21
0

Year Published

2006
2006
2021
2021

Publication Types

Select...
4
2
1

Relationship

0
7

Authors

Journals

citations
Cited by 50 publications
(23 citation statements)
references
References 16 publications
2
21
0
Order By: Relevance
“…Significant work has been carried out in the study of these flattening procedures, and majority of work has been focused in two areas: Deterministic differential equation models An example of the differential equation methods can be seen in Fu et al (), which develops a model that uses plasticity properties of the surface material to study CMP. Similar developments have been made in both lapping (Chang et al ) and grinding (Pietsch & Kerstan, ). Feature extraction This method consists of first extracting a feature from each surface. After feature extraction, traditional analysis of experiments is performed where the extracted feature is modeled as the response (e.g., Zhang et al ()).…”
Section: Case Study: Si Wafer Thickness Variation After Mechanical Lasupporting
confidence: 59%
See 1 more Smart Citation
“…Significant work has been carried out in the study of these flattening procedures, and majority of work has been focused in two areas: Deterministic differential equation models An example of the differential equation methods can be seen in Fu et al (), which develops a model that uses plasticity properties of the surface material to study CMP. Similar developments have been made in both lapping (Chang et al ) and grinding (Pietsch & Kerstan, ). Feature extraction This method consists of first extracting a feature from each surface. After feature extraction, traditional analysis of experiments is performed where the extracted feature is modeled as the response (e.g., Zhang et al ()).…”
Section: Case Study: Si Wafer Thickness Variation After Mechanical Lasupporting
confidence: 59%
“…Deterministic differential equation models An example of the differential equation methods can be seen in Fu et al (2001), which develops a model that uses plasticity properties of the surface material to study CMP. Similar developments have been made in both lapping (Chang et al, 2000) and grinding (Pietsch & Kerstan, 2005).…”
Section: Background and Experimental Descriptionsupporting
confidence: 54%
“…Grooves emerged at increased relative velocities and polishing pressures caused by embedded abrasives (two-body abrasion). These material removal mechanisms are typical for machining by loose abrasives and were also observed in lapping or conventional polishing processes [8,9,[11][12][13][14]. Furthermore, polishing at higher relative velocities and pressures using wheel type tools led to parallel grooves which run in feed direction, while polishing with pin type tools resulted in slightly curved grooves that do not run in feed direction due to deformation of the polymer pin type tool.…”
Section: Discussionmentioning
confidence: 89%
“…Amongst others, normal load, size, shape, and concentration of the abrasives as well as hardness of counterface and workpiece are mainly influencing these interactions between abrasives, counterface and workpiece. Furthermore, these different kinds of material removal mechanisms lead to differently distinct microtopographies of the machined surface exhibiting either multiple micro-indentations (in case of rolling abrasives) or continuous parallel grooves (in case of embedded abrasives) [8,9]. In addition, chemical reactions may occur in the contact zone that cannot be avoided but may influence material removal.…”
Section: Materials Removal In Lapping and Polishingmentioning
confidence: 99%
“…The method can either require high form accuracy or may attain free damage finishing surface. The novelty process method, not only can diminish grinding defects such as severely deformation, micro-crack, tensile residual stresses and surface layer polluted, etc, but also can achieve low cost, high surface integrity and high process precision due to combined with precision machining and finishing machining [2,3].…”
Section: Introductionmentioning
confidence: 99%