An Investigation of the Proximity Effect of Millimeter-Wave MMICs in Flip-Chip Configuration

Abstract

Abstract¾ A comparison between flip-chip mounting of monolithic microwave integrated circuits (MMICs) in microstrip transmission line technology and coplanar transmission line technology is presented. The influence of substrate proximity effects on the electrical behavior of the MMICs is examined and illustrated in normalized frequency independent graphs. Based on the results of this work, the performance of microstripMMICs used in flip-chip configuration can be estimated as a function of the chosen assembly geometry.