2017
DOI: 10.1016/j.apsusc.2017.02.043
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An investigation on 800 nm femtosecond laser ablation of K9 glass in air and vacuum

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Cited by 27 publications
(5 citation statements)
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“…Besides the HSFL structures, oriented perpendicular to the laser polarization, low spatial frequency ripples parallel to the laser polarization (LSFL-||) are typically formed for higher fluences or number of pulses on silica-based glasses 32 35 . Their formation mechanism was explained by Sipe theory representing an analytical solution for electromagnetic wave interaction with rough surface 36 and further expanded by taking into account the changes of the optical properties of fused silica during ultrashort laser irradiation 33 .…”
Section: Introductionmentioning
confidence: 99%
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“…Besides the HSFL structures, oriented perpendicular to the laser polarization, low spatial frequency ripples parallel to the laser polarization (LSFL-||) are typically formed for higher fluences or number of pulses on silica-based glasses 32 35 . Their formation mechanism was explained by Sipe theory representing an analytical solution for electromagnetic wave interaction with rough surface 36 and further expanded by taking into account the changes of the optical properties of fused silica during ultrashort laser irradiation 33 .…”
Section: Introductionmentioning
confidence: 99%
“…In this article, the formation mechanisms of several types of LIPSS (LSFL-||, LSFL-⊥ and HSFL), commonly observed on the surface of dielectrics 32 35 , are elucidated. The numerical results are supported by ex-situ surface imaging and by in-situ time-resolved pump-probe diffraction experiments.…”
Section: Introductionmentioning
confidence: 99%
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“…There were nonthermal and thermal ablations in laser processing of single-crystal LaB 6 , where the nonthermal and thermal threshold fluences were represented by F th1 and F th2 , respectively. 23,24 The single-shot laser ablation corresponded to the single-shot threshold fluence F th (1), and bursts of N consecutive laser pulses ablation corresponded to the multi-shot threshold fluence F th (N).…”
Section: Ablation Threshold Analysismentioning
confidence: 99%
“…Therefore, it is necessary to increase the efficiency (ablated material/unit energy/unit of time) of the micromachining process as much as possible to fulfil the necessary requirements. Several techniques exist for processing materials with femtosecond pulses which include: direct ablation in air [14,15], back side wet etching [16][17][18], spatiotemporally enhanced focusing [19,20], laser-assisted etching (LAE) [21][22][23][24][25][26], and gas-assisted processing [27][28][29]. Although the techniques presented above all have their advantages and disadvantages, when talking about cutting/drilling deep (> 500 µm) structures inside the material, all of the stated techniques fall short (with the exception of LAE), and ultimately fall victim to slow processing and heat-affected zones around the cut.…”
Section: Introductionmentioning
confidence: 99%