An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process

Eslami, Parvin Alizadeh; Taheri, Ali

doi:10.1016/j.matlet.2011.03.053

Cited by 71 publications

(23 citation statements)

References 19 publications

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“…Hence, interfacial reactions between copper and aluminum are technically and scientifically important in many technological applications. Many scholars have studied different processing methods for fabricating Cu/Al couples, such as diffusion bonding [3][4], friction stir welding [5][6], compound casting [7][8], and hydrostatic extrusion [9]. It is well known that with different methods and conditions, different intermetallic compounds (IMCs) are likely to form at the Cu/Al interface.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

Han

Ben

Yao

et al. 2015

Int J Miner Metall Mater

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Cu/Al composites are of vital importance in industrial applications because of their numerous advantages. The influence of bonding temperature and cooling rate on the microstructure and morphology of Cu/Al composites was investigated in this paper. The interfacial morphology and constituent phases at the Cu/Al interface were analyzed by optical microscopy and field-emission scanning electron microscopy equipped with energy-dispersive X-ray spectroscopy. The results indicate that effective Cu-Al bonding requires a higher bonding temperature to facilitate interdiffusion between the two metals. The microstructural characteristics are associated with various bonding temperatures, which impact the driving force of interdiffusion. It is observed that cooling rate exerts a significant influence on the morphology and amount of the intermetallic compounds at the interfacial region. Meanwhile, microhardness measurements show that hardness varies with the bonding temperature and rate of cooling.

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Section: Introductionmentioning

confidence: 99%

“…Diffusion bonding is a process in which two materials are held together at a temperature below the melting point of the materials under a low pressure, which does not generate macroscopic plastic deformation in the materials [4,13]. In the present work, the diffusion bonding technique has been used to fabricate Cu/Al couples.…”

Section: Introductionmentioning

confidence: 99%

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

Han

Ben

Yao

et al. 2015

Int J Miner Metall Mater

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“…This was due to increased migration of atoms across the joint. This meant that prolonging the holding time would complete the diffusion mechanisms and lead to a better void closure [6]. Based on the above findings, it could be inferred that, similar to the bonding temperature, the increase of the holding time led to an increase in the reaction layer thickness.…”

Section: Microstructure Examinationmentioning

confidence: 78%

“…Therefore, it is very important to select and control the welding process parameters [5]. Eslami et al [6] reported that bonding temperature had a double effect on the joint strength of aluminum to copper using equal channel angular extrusion process. This means that, at first the joint strength increased and then decreased.…”

Section: Introductionmentioning

confidence: 99%

A Study on the Effects Bonding Temperature and Holding Time on Mechanical and Metallurgical Properties of Al–Cu Dissimilar Joining by DFW

Safarzadeh

Paidar

Youzbashizade

2016

Trans Indian Inst Met

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The aim of this study was to evaluate the influence of bonding temperature and holding time on the metallurgical and mechanical properties for weld joints of 5 mm aluminum to copper using Sn interlayer. The bonding temperature varied from 500 to 600°C whilst the holding time varied from 30 to 120 min under 8 MPa uniaxial load in 1 9 10 -4 torr vacuum. The microstructure analysis, phase analysis and distribution of elements in the interface were performed by scanning electron microscopy, energy-dispersive X-ray spectroscopy, and element map analysis. It was found that diffusion welding parameters had a significant effect on shear strength. The attained data of tensile strength tests showed that the shear strength increased with increasing bonding temperature and holding time, although in 120 min, the holding time had a bilateral effect on the shear strength and shear strength dropped marginally as holding time increased. The highest shear strength value was 110 MPa which was obtained for the samples joined for 60 min holding time and 600°C bonding temperature. Further, the results showed that parameters had significant effect on the thickness of reaction layers.

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“…It is more widely applied to the fields of building, electric-power, and chemical industries [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Characterization and Bonding Properties of Copper/Aluminum Clad Sheets Processed by Horizontal Twin-Roll Casting, Multi-Pass Rolling, and Annealing

Mao

Xie

Wang

et al. 2018

Metals

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Abstract:The copper/aluminum (Cu/Al) clad sheets were produced on a horizontal twin-roll caster and then were multi-pass rolled and annealed. The thickness of the as-cast clad sheet was 8 mm. Rolling was performed with total reductions of 12.5%, 25%, 37.5%, 50%, and 62.5%, separately. The effects of the rolling and annealing processes on the interface and peel strength of the Cu/Al clad sheets were investigated. The evolution of the interface and crack propagation were studied. The interface thickness of the as-cast clad sheet reached 9 µm to 10 µm. The average peel strength (APS) was only 9 N/mm. After multi-pass rolling, the peel strength first slightly increased and then gradually decreased with the increase of the rolling pass number. After annealing, the peel strength remarkably improved. The APS reached 25 N/mm when the rolled thickness was 7 mm. The improvement in the peel strength was due to the following three factors: (1) mechanical locking formed in the Cu/Al direct contact region after rolling, (2) the region of the Al matrix fracture, and (3) mechanical biting from the Cu/Al direct contact region.

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An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process

Cited by 71 publications

References 19 publications

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

A Study on the Effects Bonding Temperature and Holding Time on Mechanical and Metallurgical Properties of Al–Cu Dissimilar Joining by DFW

Interfacial Characterization and Bonding Properties of Copper/Aluminum Clad Sheets Processed by Horizontal Twin-Roll Casting, Multi-Pass Rolling, and Annealing

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