An Investigation on the Shear Toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb Solder Ball Joints

Hsu, Chao-Ming; Hung, Tsung Pin; Lin, Ah Der; Kuang, Jao-Hwa

doi:10.4028/www.scientific.net/amr.476-478.2455

Cited by 2 publications

(1 citation statement)

References 4 publications

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“…Shear height is limited to 1/4 ball height. [4] Results for the isothermal aging tested solders Fig. 1 (a) shows that, in the initial 2 hrs, the shear forces increase from 2.6N and 2.8N to 3.1N and 3.4N for the Sn/37Pb and Sn/3.0Ag/0.5Cu solder joints of 300µm.…”

Section: Methodsmentioning

confidence: 99%

Shear Toughness Evaluation of Solder Joints for the Reliability Tests

Hsu

Lin

Hung

et al. 2013

AMM

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The effects of isothermal aging and the thermal cycling loading on the shear toughness of different solder materials and ball sizes have been explored. The difference between shear toughness values of traditional Sn/37Pb eutectic solder ball joints and the lead free Sn/3.0Ag/0.5Cu solders are chosen for discussion. The experiment measurements under the ball shear test (BST) have been compared and studied for both solder joints. The fracture behaviors of the solder joints under the high temperature aging and thermal cycling testing are examined by scanning electron microscope (SEM). The variation of shear toughness of different ball joints reveals that the high temperature aging and thermal cyclic loading reduce the shear toughness significantly. The measured shear toughness values indicate that the Sn/3.0Ag/0.5Cu solder joints have better ductility for the joints undergoing the high temperature aging and the thermal cycle loadings. Based on the measured results, the better reliability for the Sn/3.0Ag/0.5Cu ball joints is expected, due to the aging and cycling load testing.

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Section: Methodsmentioning

confidence: 99%

Shear Toughness Evaluation of Solder Joints for the Reliability Tests

Hsu

Lin

Hung

et al. 2013

AMM

View full text Add to dashboard Cite

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Optimal design of high concentration reflected photovoltaic module

Hsu

Lin

2017

AIP Conference Proceedings

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In this study, a fabrication and design process of a high concentration reflected photovoltaic (HCRPV) using 3x3 array modules with the light guide tube and III-V solar cells are demonstrated. The developed and designed of 3x3 array modules with the light guide tube following key design aims are all satisfied with highly uniform irradiance on the solar cell absorber and maximum light collective efficiency. With the use of the maximum peak power output from the tracking system which had two phases of X-Y axis and-axis tracking the sun position precisely and getting. With an optimized high concentration reflected photovoltaic systems of 3x3 array modules with the light guide tube, the optimal condition and measured characteristics and efficiency was conducted. This improved HCRPV performance is attributed to the enhanced collection light power from a big reflected mirror area. The HCRPV module was then fabricated using Aluminum material and it was coated with silver material. From the simulation results, the light collective efficiency can be reached to about 94.9% with uniform irradiance. From the measurement results, the power can be calculated to be 2.62W~2.74W, which is about 90% of the power of solar cell (3W) used.

show abstract

An Investigation on the Shear Toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb Solder Ball Joints

Cited by 2 publications

References 4 publications

Shear Toughness Evaluation of Solder Joints for the Reliability Tests

Shear Toughness Evaluation of Solder Joints for the Reliability Tests

Optimal design of high concentration reflected photovoltaic module

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