An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Gong, Yanpeng; Qin, Fei; Dong, C.Y.; Trevelyan, J.

doi:10.1016/j.apm.2022.03.047

Applied Mathematical Modelling

2022

DOI: 10.1016/j.apm.2022.03.047

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An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Yanpeng Gong

Fei Qin

C.Y. Dong

et al.

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Cited by 13 publications

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An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Cited by 13 publications

References 84 publications

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