An overview of smart conductive adhesive

Abstract

in this article it is presented an introduction in smart conductive adhesive joining technology, a classification of the adhesive, and some generalities about the fields of application and the bonding at microscopic level.

Joining of dissimilar materials

“…Advantages of adhesive bonding are: (i) creation of a continuous bond, (ii) corrosion prevention (sealed joint), (iii) stress distribution over a joint area, (iv) vibration reduction, (v) invisibility of joints within assembly, (vi) minimization of an assembly mass, (vii) no substrate deformation and (vii) minimizations of components in an assembly (Niagu et al [179]; Small and Courtney [224]; Yacobi et al [284]). …”