An ultrafast 2-D non-resonant cutting tool for texturing micro-structured surfaces

Wang, Jianjian; Du, Hanheng; Gao, Shiming; Yang, Yang; Zhu, Zhiwei; Guo, Ping

doi:10.1016/j.jmapro.2019.10.023

Cited by 29 publications

(10 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this analysis, the radius of the NHPJ is set to be 0.8 mm, considering the attainable machining accuracy for the fabrication of the designed device. The value of neck thickness varies from 0.2 to 0.35 mm, according to the dimensional range in previous researches [39,42,48]. The results of the calculated cross-axis coupling ratio by the FEA are shown in Fig.…”

Section: Neck Thickness Of the Nhpjmentioning

confidence: 97%

“…They also developed another kind of non-resonant EVC device without the cooling system; thus, it could only work at up to 400 Hz [41]. A 2-D non-resonant vibration cutting tool was recently developed by Wang et al [42] for surface texturing that claimed a working bandwidth of up to 6 kHz based on the results of the frequency sweep test. Nevertheless, it was specially designed for a three-linear-axis machine set-up which is incapable of diamond turning.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A high-frequency non-resonant elliptical vibration-assisted cutting device for diamond turning microstructured surfaces

Wang

Luo

Liu

et al. 2021

Int J Adv Manuf Technol

View full text Add to dashboard Cite

In recent years, research has begun to focus on the development of non-resonant elliptical vibration-assisted cutting (EVC) devices, because this technique offers good flexibility in manufacturing a wide range of periodic microstructures with different wavelengths and heights. However, existing non-resonant EVC devices for diamond turning can only operate at relatively low frequencies, which limits their machining efficiencies and attainable microstructures. This paper concerns the design and performance analysis of a non-resonant EVC device to overcome the challenge of low operational frequency. The structural design of the non-resonant EVC device was proposed, adopting the leaf spring flexure hinge (LSFH) and notch hinge prismatic joint (NHPJ) to mitigate the cross-axis coupling of the reciprocating displacements of the diamond tool and to combine them into an elliptical trajectory. Finite element analysis (FEA) using the mapped meshing method was performed to assist the determination of the key dimensional parameters of the flexure hinges in achieving high operational frequency while considering the cross-axis coupling and modal characteristics. The impact of the thickness of the LSFH on the sequence of the vibrational mode shape for the non-resonant EVC device was also quantitatively revealed in this study. Moreover, a reduction in the thickness of the LSFH can reduce the natural frequency of the non-resonant EVC device, thereby influencing the upper limit of its operational frequency. It was also found that a decrease in the neck thickness of the NHPJ can reduce the coupling ratio. Experimental tests were conducted to systematically evaluate the heat generation, cross-axis coupling, modal characteristics and diamond tool’s elliptical trajectory of a prototype of the designed device. The test results showed that it could operate at a high frequency of up to 5 kHz. The cross-axis coupling ratio and heat generation of the prototype are both at an acceptable level. The machining flexibility and accuracy of the device in generating microstructures of different wavelengths and heights through tuning operational frequency and input voltage have also been demonstrated via manufacturing the micro-dimple arrays and two-tier microstructured surfaces. High-precision microstructures were obtained with 1.26% and 10.67% machining errors in wavelength and height, respectively.

show abstract

Section: Neck Thickness Of the Nhpjmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 99%

A high-frequency non-resonant elliptical vibration-assisted cutting device for diamond turning microstructured surfaces

Wang

Luo

Liu

et al. 2021

Int J Adv Manuf Technol

View full text Add to dashboard Cite

show abstract

“…4(a) shows the principle of inclined groove cutting, where a 2-D ultrafast vibration cutting tool is used to provide prescribed elliptical trajectories. The ultrafast tool is designed by Wang et al (2019) to have a frequency bandwidth of up to 6 kHz and a workspace of 16 μm × 10 μm to generate high-frequency elliptical vibration in a fully controllable manner. The workpiece, pre-polished silicon wafer with the surface roughness better than 0.5 nm, has a crystal plane of (100).…”

Section: Experimental Setup For Grooving Testsmentioning

confidence: 99%

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practicable nominal cutting velocity

Wang

Yang

Zhu

et al. 2020

Journal of Materials Processing Technology

Self Cite

View full text Add to dashboard Cite

This study investigates the ductile-to-brittle transition behavior in elliptical vibration cutting (EVC) of silicon and identifies the practical process window for ductile-regime cutting. EVC has been reported to increase the critical depth of ductile-regime cutting of silicon. This study demonstrates that the enhanced ductile cutting performance, however, is only optimal in a carefully-determined process window. The vibration amplitudes and nominal cutting velocity have significant impacts on the ductile-to-brittle transition behaviors. Systematic experiments covering a wide span of vibration amplitudes and cutting velocity have been conducted to investigate their effects. Two quantitative performance indices, the critical depth and ductile ratio, are utilized to analyze cutting performance by considering two unique characteristics of elliptical vibration cutting, i.e., the time-varying undeformed chip thickness and effective cutting direction angle. The results show that there exists a lower bound for the nominal cutting velocity to ensure the ductile-regime material removal, besides the well-known upper bound. Besides, the increases of vibration amplitudes in both the cutting and depth-of-cut (DOC) directions first enhance but then deteriorate the cutting performance. Based on the theoretical analysis and experimental results, the optimal process parameters have been recommended for the elliptical vibration cutting of silicon.

show abstract

“…Besides, vibration-assisted cutting [42], especially elliptical vibration cutting (EV-cutting) [43,44], has emerged as a promising surface texturing approach for metallic materials. In vibration-assisted cutting, a microscale vibration is superimposed into the tool by a nonresonant [45,46] or resonant [47] device. Tool vibration traces are left on the material surface to form microstructures [48,49], whose shape is a function of the tool geometry and trajectory [50].…”

Section: Introductionmentioning

confidence: 99%

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Li,

Zhang,

Zheng

et al. 2024

Int. J. Extrem. Manuf.

Self Cite

View full text Add to dashboard Cite

High-aspect-ratio metallic surface microstructures are increasingly demanded in breakthrough applications, such as high-performance heat transfer enhancement and surface plasmon devices. However, the fast and cost-effective fabrication of high-aspect-ratio microstructures on metallic surfaces remains challenging for existing techniques. This study proposes a novel cutting-based process, namely elliptical vibration chiseling (EV-chiseling), for the high-efficiency texturing of surface microstructures with an ultrahigh aspect ratio. Unlike conventional cutting, EV-chiseling superimposes a microscale elliptical vibration on a backward-moving tool. The tool chisels into the material in each vibration cycle to generate an upright chip with a high aspect ratio through material deformation. Thanks to the tool’s backward movement, the chip is left on the material surface to form a microstructure rather than falling off. Since one microstructure is generated in one vibration cycle, the process can be highly efficient using ultrafast (>1 kHz) tool vibration. A finite element analysis model is established to explore the process mechanics of EV-chiseling. Next, a mechanistic model of the microstructured surface generation is developed to describe the microstructures’ aspect ratio dependency on the process parameters. Then, surface texturing tests are performed on copper to verify the efficacy of EV-chiseling. Uniformed micro ribs with a spacing of 1~10 μm and an aspect ratio of 2~5 have been successfully textured on copper. Compared with the conventional EV-cutting that uses a forward-moving tool, EV-chiseling can improve the aspect ratio of textured microstructure by up to 40 times. The experimental results also verify the accuracy of the developed surface generation model of microstructures. Finally, the effects of elliptical trajectory, depth of cut (DoC), tool shape, and tool edge radius on the surface generation of micro ribs have been discussed.

show abstract

An ultrafast 2-D non-resonant cutting tool for texturing micro-structured surfaces

Cited by 29 publications

References 20 publications

A high-frequency non-resonant elliptical vibration-assisted cutting device for diamond turning microstructured surfaces

A high-frequency non-resonant elliptical vibration-assisted cutting device for diamond turning microstructured surfaces

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practicable nominal cutting velocity

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Contact Info

Product

Resources

About