An ultralow-<i>k</i> dielectric derived from a fluorinated polybenzoxazole composite film with yolk–multishell mesoporous silica nanostructures

Zhuang, Qixin; Zhang, Zhe; He, Peng; Ma, Wenjun; Zuo, Peiyuan; Liu, Xiaoyun

doi:10.1039/d3tc00265a

Cited by 6 publications

(3 citation statements)

References 56 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Conspicuously, the detected dielectric constants are lower than those of most commercial lowk materials, including SiO 2 (k = 4.0), polyarylene ether (k = 3.0), fluropolyimide (k = 2.8), hydrogen silsesquioxane (k = 3.0), polysiloxane (k = 2.89), and benzocyclobutane (k = 2.7). 54,55 Accordingly, the fabricated PMHS-g-VTMS Silica aerogels hold great promise as an alternative for preparing lightweight and flexible conformal antennas.…”

Section: Dielectric Properties and Triboelectric Performancementioning

confidence: 99%

Super-hydrophobic and resilient hybrid silica aerogels for thermal insulation, energy harvesting, and electrical applications in harsh environments

Rezaei,

Omranpour,

Ben Rejeb

et al. 2023

J. Mater. Chem. C

View full text Add to dashboard Cite

show abstract

Section: Dielectric Properties and Triboelectric Performancementioning

confidence: 99%

Super-hydrophobic and resilient hybrid silica aerogels for thermal insulation, energy harvesting, and electrical applications in harsh environments

Rezaei,

Omranpour,

Ben Rejeb

et al. 2023

J. Mater. Chem. C

View full text Add to dashboard Cite

show abstract

“…Low dielectric constant (low- k ) polymers are essential in electronic communications for enhancing signal transmission speed and minimizing signal loss. − Polybenzoxazine is a promising thermosetting resin with low intrinsic dielectric constant, low water absorption, and high thermal stability, for which reason it has received great attention in the electronics industry. − Designing functional groups in the molecular structure of benzoxazines can further reduce the dielectric constant. Common strategies for developing low- k resins include reducing the molecular polarizability and decreasing the number density. , Through the flexible molecular design properties of benzoxazine monomers, the above strategies can be readily achieved …”

Section: Introductionmentioning

confidence: 99%

Structure–Performance Relationship of Low-k Polybenzoxazine Based on Molecular Simulation

Yuan,

Lu,

Kuo

et al. 2024

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

Low dielectric constant (low-k) polymers play a crucial role in electronic communications by improving the signal transmission speed and reducing the signal loss. In this study, five siloxane-containing benzoxazines were designed and synthesized. The effect of different substituents on the benzene ring on the ringopening curing of benzoxazine monomers was studied by nonisothermal differential scanning calorimetry and density functional theory. The corresponding polybenzoxazine models constructed using molecular simulation were employed to calculate the glass transition temperature and dielectric constant. Among them, PP-aptmds with tert-butyl substituted group on the benzene ring exhibited the best dielectric properties, with a dielectric constant of 2.44 and a dielectric loss of 0.0053 at 10 GHz. In addition, the relationship between the structure and dielectric properties of polybenzoxazines was analyzed based on dipole moment, polarizability, number density, and the highest occupied molecular orbital−lowest unoccupied molecular orbital gap. This method is expected to provide theoretical guidance for the design and development of low-k polybenzoxazines.

show abstract

“…However, challenges persist as small molecules embedded in the polymer may not be entirely removed, impacting dielectric properties. Zhuang introduced a novel and controllable selective etching strategy to fabricate yolk-multishell mesoporous silica nanoparticles, albeit involving HF etching of SiO 2 layers [15]. In addition, the integration of Cage polyhedral oligomeric silsesquioxane (POSS) hollow nanoparticles into polymers has been explored to develop low-k nano hybrid materials.…”

Section: Introductionmentioning

confidence: 99%

Polyimide Films Based on β-Cyclodextrin Polyrotaxane with Low Dielectric and Excellent Comprehensive Performance

Zhang,

Dou,

Liu

et al. 2024

Polymers

View full text Add to dashboard Cite

In order to prepare polyimide (PI) films with a low dielectric constant and excellent comprehensive performance, a two-step method was employed in this study to integrate β-cyclodextrin into a semi-aromatic fluorine-containing polyimide ternary system. By introducing trifluoromethyl groups to reduce the dielectric constant, the dielectric constant was further reduced to 2.55 at 10 MHz. Simultaneously, the film exhibited noteworthy thermal stability (a glass transition temperature exceeding 300 °C) and a high coefficient of thermal expansion. The material also demonstrated outstanding mechanical properties, boasting a strength of 122 MPa and a modulus of 2.2 GPa, along with high optical transparency (transmittance reaching up to 89% at 450 nm). Moreover, the inherent high transparency of colorless polyimide (CPI) combined with good stretchability contributed to the attainment of a low dielectric constant. This strategic approach not only opens up new opportunities for novel electroactive polymers but also holds potential applications in flexible displays, circuit printing, and chip packaging.

show abstract

An ultralow-k dielectric derived from a fluorinated polybenzoxazole composite film with yolk–multishell mesoporous silica nanostructures

Abstract: In order to solve the problem of signal delay and crosstalk caused by miniaturization of VLSI, it is urgently required to further reduce the dielectric constant (k) of materials. So...

Cited by 6 publications

References 56 publications

Super-hydrophobic and resilient hybrid silica aerogels for thermal insulation, energy harvesting, and electrical applications in harsh environments

Super-hydrophobic and resilient hybrid silica aerogels for thermal insulation, energy harvesting, and electrical applications in harsh environments

Structure–Performance Relationship of Low-k Polybenzoxazine Based on Molecular Simulation

Polyimide Films Based on β-Cyclodextrin Polyrotaxane with Low Dielectric and Excellent Comprehensive Performance

Contact Info

Product

Resources

About