An X-band small outline leaded plastic package for MMIC applications

Abstract

A new small outline (SO) leaded plastic package has been developed that improves return loss, insertion loss, and isolation performance over that of a shrink small outline package (SSOP) in the same body size. A custom TRL calibration kit was developed, and prototype packages built and measured. The measured package showed an increase in the application bandwidth of SO-type packages from 5 GHz to over 8 GHz. Further investigations using full-wave electromagnetic simulations reveal a potential increase in return loss of better than 30 dB to 10 GHz, giving the package a usable bandwidth well into the X-band (8-12 GHz). Applications for the new package are in microwave and RFIC applications.

Electromagnetic Simulation and Characterization a Metal Ceramic Package for Packaging of High Isolation Switches

“…Effects of the molding compound on the performance of Single Pole Double Throw (SPDT) switches have been studied using Electromagnetic (EM) simulation by Uda et al [1,2] and Xiao et al [3] and method to minimize the performance degradation by parasitic effect modeling has been suggested. Jessie and Larson [4] have discussed the development of a plastic Small Outline (SO) package with remarkable performance in X-band by EM optimization of the package structure and package leads. Ishitsuka and Sato [5] have described development of a metal ceramic package for Multi-Chip Module (MCM) applications.…”

Advances in RF packaging technologies for next-generation wireless communications applications [RFIC]

“…Most bond wires are [25][26][27][28][29][30] p m in diameter and between one and two millimeters in length. An approximate formula that has proven accurate at low frequencies is given by More accurate models of bond-wire inductance require full 3D simulations.…”