Analyses of Alignment Measurement Error

Abstract

Friedrich Paschen war von 190 1 bis I924 Abstract.full professor of physics d t the University of Tubingen There he worked on the three subject areas radiation law [determination of u and thus h by Walther Gerlach), w i e s formulae of line spectrd (Paschen series) and the Zseman effect (Passhen-Back-Effekt) A Rowland grating provided the necessary high resolution In particular the theoretical interpretation of the measured atomic spectrd in mdgnetic fields finally led, i n collaboration with Sommerfeld and his students. via the Lande factor to the de\elopment of quantum mechnics by Heisenberg dnd Jorddn Goudsmit was prompted to introduce the electron spin by the measurements of Back at Tubingen, and later the nuclear spin was founded through the hyperfine irructure Pauli tested his principle first with medsurement ' 11 Tubingen before publishing it

Tool-Induced Shift and Pupil Transmittance Distribution in Measurement Optics

“…We have shown the reason that asymmetrical pupil transmittance distribution causes TIS. 4) The distribution creates a distorted image and a measurement shift, TIS. This TIS is the amplitude-error-induced shift.…”

“…If the symmetrical phase difference between the 0th ray and the other diffraction rays (W ns ) is =2 [rad], we can remove the distortion of the image caused by the amplitude error caused by asymmetrical pupil transmittance distribution. 4) Namely, W ns ¼ =2 leads ÁI ¼ 0 in eqs. (10), ( 13) and ( 14).…”

“…In order to reduce amplitude error-induced shift, a method that gives the =2[rad] phase between the 0th ray and other diffraction rays is very effective. 4) FFO realizes it by focus optimization to FIA. 4) The method has shown that FFO reduces wafer-induced shift (WIS).…”

“…4) FFO realizes it by focus optimization to FIA. 4) The method has shown that FFO reduces wafer-induced shift (WIS). 5) This paper shows that FFO also has effect of reducing TIS caused by amplitude error.…”

Simple tilt and height location monitoring of wafers

“…Good wafer alignment is invaluable in lithography, dicing, or bonding, as it permits the consistent application of process parameters. Endeavors in wafer alignment can be broadly classified as efforts to ͑a͒ improve wafer placement and holding, 1-3 ͑b͒ study alignment error sources, [4][5][6] and ͑c͒ monitor the wafer position. [7][8][9][10] Techniques reported thus far for wafer position monitoring include the use of ͑i͒ imaging of marks with a CCD camera, 7 ͑ii͒ imaging of marks with a series of photosensors, 8 ͑iii͒ sensing of diffracted light from marks, 5,9 and ͑iv͒ observation of moiré patterns.…”