Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package.

Sato, Mitsuru; Yuuki, Ryoji; Inoue, Akio; Tani, Shuichi; Yoshioka, Shoji; Iwaoka, Makoto

doi:10.1299/kikaia.60.1985

Cited by 3 publications

(1 citation statement)

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“…Therefore, a reliable design for the molding resin and the bonded interface is required. When used as an example of the semi-conductor package, the flaking-off-strength evaluation technique of the bonded interface has been actively developed (1) - (3) , because flaking off on the joint field side about the lead frame and the molding resin causes the package to crack during the solder reflow.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

Ohmoto

Satoh

Hamada

2011

JMMP

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In resin-metal composite structures, such as electronic products with an epoxy resin molding insulator, the thermal fatigue of the epoxy resin during thermal cycling is a critical issue. Because the thermal stress in the epoxy resin and its strength simultaneously change during the thermal cycling, an estimation method for the thermal fatigue reliability in consideration of the temperature dependence of the fatigue strength is required. In this study, the technique of predicting the thermal fatigue crack growth rate in epoxy resin is studied and we proposed an estimation method using the strain intensity factor range ΔK/E as an evaluation parameter. In order to evaluate the proposed method, both the crack growth test by thermal cycling and the thermal stress evaluation by the visco-elastic FEM analysis were carried out. As a result, it was found that the proposed method estimated the crack growth rate under thermal fatigue test less than that of the iso-thermal fatigue test.

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Section: Introductionmentioning

confidence: 99%

Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

Ohmoto

Satoh

Hamada

2011

JMMP

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FEM and BEM in electronic packaging A bibliography (1998–1999)

Mackerle

2001

Finite Elements in Analysis and Design

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Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

2010

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In resin − metal composite structures such as electronic products with the epoxy resln molding insulator ， a thermal fatigue of the epoxy resin during thermal cycles is a critical issue ． Since a thermal stress in the epoxy resin and its strength change simultaneously d面 ng thermal cycles ， an estimation method for the thermal fatigue reliab ｛ 1ity in consideration of the temperature dependence of fa亡 igue strength is required ， In this paper ， the technique of predicting thermal fatigue crack growth rate in epoxy resin is studied and we proposed an estimation method using strain intensity factor KIE as an evaluation parameter ． In order to evaluate the proposed method ， both the crack propagation test by thermal cycles alld the thermal stress evaluation by viscoelastic FEM analysis werecarried out ． As a result ， it was found that the proposed method estimated the crack growth ra 亡e under thermal fatigue test less than that of iso − thermal fatigue test． Key rVomds ： Thermar Stress ， Fatigue ， Crack Propagation ， Visco Elasticity ， Epoxy Resin

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Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package.

Cited by 3 publications

References 0 publications

Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

FEM and BEM in electronic packaging A bibliography (1998–1999)

Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites

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