Analysis of a pre‐stressed bi‐material accelerated‐life‐test (ALT) specimen

Suhir, Ephraïm

doi:10.1002/zamm.201000101

Cited by 20 publications

(9 citation statements)

References 54 publications

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“…A highly focused and highly cost effective FOAT [47][48][49][50], which is the experimental foundation and the "heart" of the recently suggested PDfR concept [51][52][53][54][55][56][57][58][59][60][61][62][63][64] should be conducted in addition to and, in some cases, even instead of HALT, especially for highly vulnerable materials, like solders, and for new products, whose operational reliability is unclear, for which no experience is accumulated and no best practices nor HALT methodologies are not yet developed. Predictions, based on the FOAT and subsequent probabilistic predictive modeling, might not be perfect, especially at the beginning, but it is still better to pursue this effort rather than to turn a blind eye on the fact that there is always a non-zero probability of the product's failure.…”

Section: Accelerated Testing Of Solder Joint Interconnections: Failure-oriented Accelerated Testing (Foat) and Highly-accelerated-life-tementioning

confidence: 99%

Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review

Suhir¹

2018

J Aerosp Eng Mech

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This review paper is based mostly on the author's recent publications and addresses the application of analytical ("mathematical") predictive modeling to understand the physics and mechanics of the behavior and performance of solder materials and solder joint interconnections employed in IC devices. The emphasis is on the design for reliability and, first of all, on the prediction of the thermal stresses and strains in solder joint interconnections in electronic products. While the majority of the numerous studies addressing solder materials are either experimental or based on finite-element-analyses (FEA), the approach considered in this review uses analytical predictive modeling techniques to predict stresses in solder interconnections and suggest methods for stress minimization. The developed models enable to come up with the most effective design-for-reliability methodologies to relieve the induced stresses and strains in solder joints of both levels of interconnections, and to predict, at the design stage, if inelastic strains in the solder material could be avoided. If not, these models are able to establish the sizes of the inelastic zones at the end portions of the soldered assemblies. It is concluded that all the three approaches of the applied science and engineering -experimental, computer-aided and analytical -are equally important from the standpoint of making a viable electron device into a reliable product, and that this review can explain how analytical modeling can be used in predicting and possibly preventing failures of solder joints in electronic products. Review Analytical ("mathematical") modeling, its significance, role, attributes and challengesThe overwhelming majority of studies dealing with the physical design and performance of "high-tech" materials and products are experimental. There are several good reasons for that: 1) Experiments could be carried out with full autonomy, i.e. without necessarily requiring theoretical support; 2) Unlike theory, testing can be used as a final proof of the viability and reliability of a product, and is therefore essential requirement, when it comes to making a viable device into a reliable product; 3) Experiments in the high-tech field, expensive as they might be, are considerably less costly than in other areas of engineering; 4) High-tech experimentations are much easier to design, organize, and conduct than in the macro-engineering world; 5) Materials, whose properties are, in effect, not completely known, are nevertheless often and successfully employed in high-tech products;

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Section: Accelerated Testing Of Solder Joint Interconnections: Failure-oriented Accelerated Testing (Foat) and Highly-accelerated-life-tementioning

confidence: 99%

Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review

Suhir¹

2018

J Aerosp Eng Mech

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“…Nothing and nobody is perfect, and the difference between a highly reliable technology, object, product, performance or a mission and an insufficiently reliable one is "merely" in the levels of their never-zero probability of failure. Application of the PPM approach and the PDfR concept [20][21][22][23][24][25][26][27][28][29][30][31] provide a natural and an effective means for reduction of vehicular casualties. This approach, as has been indicated, can be applied also beyond the vehicular field, in devices whose operational reliability is critical, such as, e.g., military, longhaul communications systems or medical devices [32].…”

Section: St Paulmentioning

confidence: 99%

The Outcome of an Engineering Undertaking of Importance Must be Quantified to Assure its Success and Safety: Review

Suhir¹

2020

J Aerosp Eng Mech

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The outcome a of crucial engineering undertaking must be quantified at the design/planning stage to assure its success and safety, and since the probability of an operational failure is, in effect, never zero, such a quantification should be done on the probabilistic basis. Some recently published work on the probabilistic predictive modeling (PPM) and probabilistic design for reliability (PDfR) of aerospace electronic and photonic (E&P) products, including human-in-theloop (HITL) problems and challenges, is addressed and briefly reviewed. The effort was lately "brought down to earth" to model possible collision in automated driving (AD). In addition, some problems and tasks beyond the E&P and vehicular engineering field are also addressed with an objective to show how the developed methods and approached can be effectively and fruitfully employed, whenever there is a need to quantify the reliability of an engineering technology with consideration of the human performance. Accordingly, the following nine problems have been addressed in this review with an objective to show how the outcome of a critical engineering endeavor can be predicted using PPM and PDfR concept: 1) Accelerated testing in E&P engineering: Significance, attributes and challenges; 2) Failure-oriented accelerated testing (FOAT), its objective and role; 3) PPM approach and PDfR concept, their roles and applications; 4) Kinetic multi-parametric Boltzmann-Arrhenius-Zhurkov (BAZ) equation as the "heart" of the PDfR concept; 5) Burn-in-testing (BIT) of E&P products with an attempt to shed light on the basic "to BIT or not to BIT" question; 6) Adequate trust is an important constituent of the humancapacity-factor (HCF) affecting the outcome of a mission or an extraordinary situation; 7) PPM of an emergency-stopping situation in automated driving (AD) or on a railroad (RR); 8) Quantifying the astronaut's/pilot's/driver's/machinist's state of health (SoH) and its effect on his/hers performance; 9) Survivability of species in different habitats. The objective of the latter effort is to demonstrate that the developed PPM approaches and methodologies, and particularly those using multiparametric BAZ equation, could be effectively employed well beyond the vehicular engineering area.The general concepts are illustrated by numerical examples. All the considered PPM problems were treated using analytical ("mathematical") modeling. The attributes of the such modeling, the background of the multiparametric BAZ equation and the ten major principles ("the ten commandments") of the PDfR concept are addressed in the appendices.

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“…There are many ways of how this could be done (see, e.g. [24,25]). The FOAT based approach could be viewed as a quantified and reliability physics oriented HALT.…”

Section: Foat As An Extension Of Haltmentioning

confidence: 99%

Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges

Suhir

Bensoussan

Khatibi

et al. 2015

2015 IEEE International Reliability Physics Symposium

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Analysis of a pre‐stressed bi‐material accelerated‐life‐test (ALT) specimen

Cited by 20 publications

References 54 publications

Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review

Low-Cycle-Fatigue Failures of Solder Material in Electronics Packaging: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review

The Outcome of an Engineering Undertaking of Importance Must be Quantified to Assure its Success and Safety: Review

Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges

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