2012
DOI: 10.3788/fgxb20123302.0187
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Analysis of Air-cooled Heat System in Hundred-watt Level Semiconductor Laser Module

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Cited by 3 publications
(2 citation statements)
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“…The simulation calculation process does not consider radiation heat transfer and adopts turbulence method. The control equation adopts the standard k-ε Realizable two equation model, and the thermal conductive silicone grease applied between the heat source device, the heat sink has a contact thermal impedance of 0.0001   2 / C m W   [25][26] . The device parameter setting are shown in Table 3 In the case of a heat sink size of 60mm * 20mm * 15mm, the dual fans effectively cooled and dissipated heat for the heating units of heat source groups 3 and 4, and the farthest temperature of the laser chip was around 35.1 C  .…”
Section: Three Dimensional Calculation Model For Air-cooled Heat Diss...mentioning
confidence: 99%
“…The simulation calculation process does not consider radiation heat transfer and adopts turbulence method. The control equation adopts the standard k-ε Realizable two equation model, and the thermal conductive silicone grease applied between the heat source device, the heat sink has a contact thermal impedance of 0.0001   2 / C m W   [25][26] . The device parameter setting are shown in Table 3 In the case of a heat sink size of 60mm * 20mm * 15mm, the dual fans effectively cooled and dissipated heat for the heating units of heat source groups 3 and 4, and the farthest temperature of the laser chip was around 35.1 C  .…”
Section: Three Dimensional Calculation Model For Air-cooled Heat Diss...mentioning
confidence: 99%
“…The working principle of the vapor chamber is shown in Figure 1. The thermal resistance of the commonly used vapor chamber could be less than 0.5K/W, and the heat of the laser diode can be rapidly distributed laterally [6] . After using the vapor chamber, the heat dissipation area is increased, and multiple TECs can be closely attached under the vapor chamber to take away the output heat of the vapor chamber, thereby improving the cooling capacity of the system.…”
Section: Design Of the Systemmentioning
confidence: 99%