2007
DOI: 10.1016/j.sse.2007.02.037
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Analysis of Al/Ti, Al/Ni multiple and triple layer contacts to p-type 4H-SiC

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Cited by 39 publications
(21 citation statements)
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“…The formation of these compounds at elevated temperature is also supported by the Ti-Al-SiC equilibrium phase diagram, 71 which predicts that four phases, SiC, Al 4 C 3 , Ti 3 SiC 2 , and liquid, can coexist in an equilibrium state when the aforementioned composition of TiAl alloy is adopted. Furthermore, the XRD results agree well with the experimental reports of Jennings et al 72 and Johnson and Capano, 29 but deviate somewhat from those of Nakatsuka et al, 28 which show that binary Al 3 Ti is present as well. This slight difference is mainly because the intensity of Al 3 Ti peak is so low that might be overlapped by the strong peaks of SiC and Ti 3 SiC 2 .…”
Section: B Identification Of Reaction Productssupporting
confidence: 84%
“…The formation of these compounds at elevated temperature is also supported by the Ti-Al-SiC equilibrium phase diagram, 71 which predicts that four phases, SiC, Al 4 C 3 , Ti 3 SiC 2 , and liquid, can coexist in an equilibrium state when the aforementioned composition of TiAl alloy is adopted. Furthermore, the XRD results agree well with the experimental reports of Jennings et al 72 and Johnson and Capano, 29 but deviate somewhat from those of Nakatsuka et al, 28 which show that binary Al 3 Ti is present as well. This slight difference is mainly because the intensity of Al 3 Ti peak is so low that might be overlapped by the strong peaks of SiC and Ti 3 SiC 2 .…”
Section: B Identification Of Reaction Productssupporting
confidence: 84%
“…2. Sample details All fabrication steps [20] were done in clean room (class 1000) using metal-oxide-semiconductor (MOS) grade chemicals. 4H-SiC and 6H-SiC wafers (Si terminated) were provided by Cree Research Corporation.…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…metal silicides). Recent developments have improved the specific contact resistance to a level of approximately 5×10 −6 Ωcm 2 [29]- [31]. Reducing the contact resistance to this level or less will be necessary for the practical utilisation of SiC bipolar devices.…”
Section: A Materials Effectsmentioning
confidence: 99%