Analysis of copper treatments and the effects on signal propagation

Pytel, S.G.; Huray, Paul G.; Hall, S.; Mellitz, Richard; Brist, Gary

doi:10.1109/ectc.2008.4550120

Cited by 7 publications

(1 citation statement)

References 3 publications

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“…However, to promote the interface-adhesion reliability between the resin and copper, surface treatments of copper foils are commonly applied to printed circuit board (PCB) manufacturing. The copper roughness is caused by the electrodeposition of small copper “anchor nodules” (Pytel et al , 2008; Suzuki, 2017; Devahif, 2016) and the roughening process before lamination (Wang et al , 2015; Nothdurft et al , 2019).…”

Section: Introductionmentioning

confidence: 99%

A modified model of conductor roughness for manufacturing copper lines of printedcircuit board

Wang

Adi

et al. 2021

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Purpose The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board. Design/methodology/approach To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results. Findings An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing. Originality/value This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

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Section: Introductionmentioning

confidence: 99%