A rectangle disbonded coating simulation device was used to research the effect of sulfate reducing bacteria (SRB) on the metallic corrosion behavior under disbonded coating by the electrochemical method. The results showed that the metal self-corrosion potential at the same test point had little change in the initial experiment stage, whether the solution was without or with SRB. The potential amplitude in the solution with SRB was larger than that without SRB in the later corrosion period. The corrosion current density of the metal at the same test point increased gradually over time in the solution with or without SRB, and SRB could accelerate the corrosion of the metal in the disbonded crevice. The metal self-corrosion potential in the crevice had little change in the SRB solution environment after adding the fungicide, but the corrosion current density decreased significantly. That meant the growth and reproduction of SRB were inhibited after adding the fungicide, so the metal corrosion rate slowed down. Among the three kinds of solution environment, increasing the coating disbonded thickness could accelerate the corrosion of the metal in the crevice, and it was the largest in the solution with SRB.