Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw

Yin, Youkang; Gao, Yufei; Wang, Liyuan; Zhang, Lei; Pu, Tianzhao

doi:10.1016/j.solener.2021.01.009

Cited by 42 publications

(8 citation statements)

References 27 publications

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“…To our knowledge there are no papers on direct wire saw cutting process control, except our previous work. [18][19][20] In this paper, control-oriented models of the cutting forces, both normal and tangential, were constructed. Controllers were designed and used to adjust the wire velocity during the cutting process to improve operation efficiency.…”

Section: Discussionmentioning

confidence: 99%

“…Two theoretical models were proposed to quantitatively predict the required applied normal forces at the expected machined depths, which were obtained with a solution to the horizontal projection of the sample–tip contact area and the multi-edge form tip based on a generalized cutting approach, respectively Li et al 18 conducted experiments and found that certain feed angles of the diamond wire saw can be chosen to obtain the least surface shape deviation and reduce the influence of anisotropy of silicon. Yin et al 19 established a mathematical model of diamond wire sawing based on the machining mechanism of brittle material removal and surface generation. The numerical calculation of the sawing process was also conducted.…”

Section: Introductionmentioning

confidence: 99%

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Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

Wang,

Li,

Liang

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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Single crystal silicon wafers are often used as substrate material for integrated circuits. Often the wafer is cut by a wire with fixed abrasive diamond owning to a narrow kerf and a low cutting force. The cutting force changes during the process as the direction of wire movement continuously reverses (i.e., reciprocates), which may cause the wire saw to break, the wafer to collapse, and the wafer surface roughness to decrease even if the wire saw tension and the contact length between the wire and the wafer are fixed. In this work, a cutting force model including both normal and tangential forces was established to determine the relationship between the normal and tangential forces and the commanded wire speed. Separate controllers were developed to regulate both the normal force and the tangential force by adjusting the wire velocity. Experimental studies were conducted for wire saw processing of single crystal silicon wafers. Compared with a process using constant wire velocity, regulating the normal force can significantly reduce the processing time and the wafer surface roughness. The average improvements in processing time and wafer surface roughness are approximately 11% and 56%, respectively, when using normal force control, and approximately 29% and 30%, respectively, when using tangential force control. The results show that the normal and tangential forces can be well regulated during the machining process. In addition, the wafer surface roughness and machining time were lower in both experiments where the forces were regulated than in the experiment where a constant wire velocity was used. This paper demonstrates that the novel concept of regulating process forces in wire saw machining by adjusting the wire velocity can be used to optimize the cutting process of single crystal silicon, making the process more productive while decreasing the part roughness.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

Wang,

Li,

Liang

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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show abstract

“…where 2θ is the abrasive tip angle [19], θ = 65°, a p is the abrasive depth of penetration, μ s is the coefficient of friction between the abrasive and part, and H a is the part hardness. The number of abrasives in contact with the part is [20]…”

Section: Cutting Force Modelingmentioning

confidence: 99%

Dynamic Force Modeling of Wire Saw Machining Processes

Lie¹,

Wang³

et al. 2023

Preprint

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Wire saw machining is extensively used to cut hard and brittle materials because of the resulting narrow kerf size, low cutting forces, and minimal material waste. The change of cutting forces strongly affects the part surface quality. Current models compute static machining forces based on the process variables and cutting conditions. This paper builds a dynamic machining force model that includes the effect of the wire tension and describes how the force changes as the wire engages with the part and as the wire changes direction due to reciprocation. Machining of silicon monocrystal parts is used to experimentally validate the proposed dynamic force model. The results show a very good correlation between the simulated and experimental data. The model captures the transient effect of the machining forces as the wire becomes fully engaged with the part and it is able to capture the fluctuations in the normal force, which is due to the changes in wire tension, as the wire reciprocates.

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“…With the increase of wire cutting speed, there were more regions formed in ductile mode. Yin et al [13] established a mathematical model of diamond wire sawing based on the machining mechanism of brittle material removal and surface generation, and carried out a numerical calculation of the sawing process. It was found that it is more conducive to obtaining a crack-free sawn surface by reducing the workpiece feed speed or increasing the saw wire movement speed, and the workpiece feed speed has a greater impact on the sawn surface quality.…”

Section: Introductionmentioning

confidence: 99%

Prediction and verification of wafer surface morphology in ultrasonic vibration assisted wire saw (UAWS) slicing single crystal silicon based on mixed material removal mode

Wang

et al. 2022

Int J Adv Manuf Technol

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Monocrystalline silicon is one of the most important semiconductor materials, widely used in chip manufacturing, solar panels. Slicing is the first step in making chips and the surface quality of silicon wafers directly affects the quality of later processing and accounts for a large proportion in the chip manufacturing cost. Ultrasonic vibration assisted wire saw (UAWS) is an effective sawing process for cutting hard and brittle materials such as monocrystalline Si, which can significantly improve the surface quality of silicon wafers. In order to further study the formation mechanism of the surface morphology of single crystal silicon sliced by UAWS, a new model for prediction of wafer surface morphology in UAWS slicing single crystal silicon based on mixed material removal mode is presented and verified in this paper. Firstly, the surface model of diamond wire saw tool is established by equal probability method. Then according to the equation of transverse vibration dynamics about the wire saw with ultrasonic excitation, the trajectory equation of arbitrary abrasive particles on the surface of wire saw is derived and analyzed. Thirdly, a new model for prediction of the wafer surface morphology based on mixed material removal mode is presented, which can be used to predict the wafer surface morphology of single crystal silicon sliced by UAWS. Finally, the prediction model is verified by UAWS slicing experiment, and the effects of slicing parameters such as wire saw speed, feed speed and workpiece rotate speed on the surface quality of silicon wafer were studied. It shows that the predicted wafer surface morphology and the experimental wafer surface morphology are similar in some characteristics, and the average error between the experimental and the theoretical values of the wafer surface roughness is 11.9%, which verifies the validity of the prediction model.

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Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw

Cited by 42 publications

References 27 publications

Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

Dynamic Force Modeling of Wire Saw Machining Processes

Prediction and verification of wafer surface morphology in ultrasonic vibration assisted wire saw (UAWS) slicing single crystal silicon based on mixed material removal mode

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