Analysis of critical thermal issues in 3D integrated circuits

Tavakkoli, Fatemeh; Ebrahimi, Siavash; Wang, Shujuan; Vafai, Kambiz

doi:10.1016/j.ijheatmasstransfer.2016.02.010

Cited by 79 publications

(16 citation statements)

References 35 publications

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“…cooling, on the other hand, is the major bottleneck for proper functioning of devices due to the formation of local hot spots with large on-chip temperature gradients [5,6].…”

Section: Nano-grooved Heat Pipesmentioning

confidence: 99%

A first look at the performance of nano-grooved heat pipes

Akkuş

Nguyen

Celebi

et al. 2019

International Journal of Heat and Mass Transfer

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Passive thermal spreaders utilizing liquid/vapor phase-change mechanism such as heat pipes, have been widely used in the macro-scale thermal management of electronic devices for many years. Micro-fabrication techniques enabled the fabrication micro-scale grooved heat pipes on semiconductors. Recent advances in fabrication techniques, on the other hand, enabled producing nano-andångström-scale capillaries and cavities, which renders the manufacturing of nanoscale heat pipes possible. In the present study, we have simulated nanoscale heat pipes composed of nano-grooves using molecular dynamics and evaluated their performance based on different operating parameters such as the filling ratio and heat load. Moreover, evaluation of size effect on the thermal performance is made by comparing proportionally scaled heat pipes. Simulation results reveal that efficient operation of nano-grooved heat pipes depend not only on the proper selections of filling ratio and heat load, but also on the geometrical parameters such as cross sectional dimensions and aspect ratio of the groove. The modeling strategy used in this study opens an opportunity for computational experimentation of nanoscale heat pipes. Nano-Grooved Heat PipesAkkus et al.cooling, on the other hand, is the major bottleneck for proper functioning of devices due to the formation of local hot spots with large on-chip temperature gradients [5,6].Thermal scientists have long been seeking efficient techniques to cool HHF devices. Singlephase cooling methods are impractical due to the high temperature difference and pumping needs [7]. Phase-change methods are desirable addressing their advantage in high latent heat of evaporation, which enables removal of high amount of heat with small temperature difference. Passive thermal spreaders utilizing liquid/vapor phase-change mechanism such as vapor chambers and heat pipes, are widely used in electronic cooling. Closed loop circulation of the working fluid is provided by the capillary pumping in liquid phase and density gradient in the vapor phase. While the vapor chambers have excellent hot spot removal ability by transporting the localized heat from a source to a large heat rejection surface, heat pipes function as superconductors to remove the waste heat away from the source.The first heat pipe was using wire mesh wick structure to pump the condensate to the evaporator section [8]. Then a single sealed non-circular micro-channel, whose sharp-angled corners work as liquid arteries, was proposed as micro heat pipes [9]. To increase the heat carrying capacity of a heat pipe, the number of liquid arteries should be maximized. Consequently, grooved heat pipes, which utilize multiple grooves machined on the inner wall of the base metal as the wick structures, have emerged and been widely studied in the literature due to the relative ease of their precise manufacturing and developing numerical solutions to estimate their performance [10,11,12,13,14,15,16,17]. Moreover, micro-electro-mechanical systems (MEMS) based micro-fabricat...

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“…cooling, on the other hand, is the major bottleneck for proper functioning of devices due to the formation of local hot spots with large on-chip temperature gradients [5,6].…”

Section: Nano-grooved Heat Pipesmentioning

confidence: 99%

A first look at the performance of nano-grooved heat pipes

Akkuş

Nguyen

Celebi

et al. 2019

International Journal of Heat and Mass Transfer

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“…Our thermal model is based on a generalized 3D IC structure under consideration, based on our nominal structure attributes study. Figure 1 shows the schematic of a nominal 3D IC which was presented in our earlier work [7]. As the schematic illustrates, the structure consists of three circuit layers mounted on the silicon substrate.…”

Section: Modeling and Analysismentioning

confidence: 99%

“…Therefore, the total power consumption for a three layer Fig. 1 Schematic of the 3D IC [7] 082101-2 / Vol. 138, AUGUST 2016 Transactions of the ASME nominal 3D IC chip is P ¼ 90W.…”

Section: Modeling and Analysismentioning

confidence: 99%

“…At the channel outlet, the cooling fluid is assumed to exit the package at atmospheric pressure with negligible streamwise temperature gradient. The outlet boundary conditions are as follows: Table 1 presents the nominal values for various components of the 3D IC, such as material selection, dimensional attributes, and number of layers, based on the pertinent thermal analysis of 3D ICs performed in previous work [7]. The nominal values for different geometrical and thermophysical attributes of TSVs utilized in the 3D IC structure, based on values obtained from pertinent literature, are also given in Table 1.…”

Section: Modeling and Analysismentioning

confidence: 99%

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Thermophysical and Geometrical Effects on the Thermal Performance and Optimization of a Three-Dimensional Integrated Circuit

Tavakkoli

Ebrahimi

Wang

et al. 2016

Journal of Heat Transfer

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A comprehensive analysis and optimization of a three-dimensional integrated circuit (3D IC) structure and its thermophysical attributes are presented in this work. The thermophysical and geometrical attributes studied in this paper include the die, device layer, heat sink, and heat spreader, which are critical structures within a 3D IC. The effect of the power density of the device layer which is the source of heat generation within the chip as well as the through silicon vias (TSV) and microbumps is also considered in our investigation. The thermophysical and geometrical parameters that have a significant impact on the thermal signature of the 3D IC as well as those that have an insignificant impact were established. The comprehensive analysis of different geometrical and thermophysical attributes can guide the design and optimization of a 3D IC structure and decrease the cost.

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“…Within the scope of this PhD work, a 3D IC is interesting because heat extraction is a particular concern. Unlike 2D circuits, the additional material layers trap the heat [173]. Different solutions have therefore been proposed to alleviate thermal congestion, ranging from algorithmic approaches (i.e.,thermal floorplanning or thermal TSV placement) [172] to microfluidic channels [174].…”

Section: For 3d Interconnectsmentioning

confidence: 99%

Thermal failure of carbon nanostructures

Maurice¹

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Analysis of critical thermal issues in 3D integrated circuits

Cited by 79 publications

References 35 publications

A first look at the performance of nano-grooved heat pipes

A first look at the performance of nano-grooved heat pipes

Thermophysical and Geometrical Effects on the Thermal Performance and Optimization of a Three-Dimensional Integrated Circuit

Thermal failure of carbon nanostructures

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