Analysis of Crosstalk Noise for Coupled Microstrip Interconnect Models in High-Speed PCB Design

Mudavath, Raju; Naik, Bighnaraj; Gugulothu, Bhaskar

doi:10.23919/elinfocom.2019.8706385

Cited by 7 publications

(4 citation statements)

References 9 publications

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“…When the input signal is transmitted along the attack line, mutual capacitance C m and mutual inductance L m will be formed with the victim line, C T is the sum of mutual capacitance and self-capacitance between transmission lines, and L S is the self-inductance of transmission lines. Equation (1) shows that from the circuit point of view, changing the ratio of the capacitive coupling and the inductive coupling between the coupled microstrip lines is the most direct and effective way to improve the far-end crosstalk.…”

Section: Analysis Of Crosstalk Between Coupled Microstrip Linesmentioning

confidence: 99%

“…The spacing between the microstrip lines is extremely small due to the high integration requirements of circuits, so it is easy to generate coupling crosstalk between the microstrip lines. 1 In order to comply with the development trend of integrated circuits, researchers, and engineers are exploring ways to improve crosstalk. They analyzed the formation principles and influencing factors of crosstalk between two or more transmission lines, and developed methods to improve F I G U R E 1 Coupled microstrip line in EM field crosstalk.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Crosstalk reduction between microstrip lines using TL‐shaped defected microstrip structure

2022

Engineering Reports

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Aiming at the problem of far‐end crosstalk between microstrip lines, a method to improve crosstalk by using the TL‐shaped defective microstrip structure (DMS) is proposed. This method optimizes the ratio of the capacitive coupling and the inductive coupling between coupled microstrip lines by etching TL‐shaped DMSs on the microstrip lines, reducing the strength of electromagnetic coupling, thereby achieving an improvement in crosstalk. The quantitative equivalent model, S‐parameters, and full‐wave EM simulations are used to analyze the frequency response of the TL‐shaped DMS and crosstalk between the microstrip lines. The results of High Frequency Structure Simulator software simulation and sample texts show that the TL‐shaped DMS can effectively improve the far‐end crosstalk while ensuring the transmission of signals on the microstrip line. In the frequency range of 0–8 GHz, the far‐end crosstalk can be improved by about 11 dB, and the maximum can be improved by 42 dB. Compared with other DMSs, the TL‐shaped DMS has better crosstalk improvement effect and practical application potential.

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Section: Analysis Of Crosstalk Between Coupled Microstrip Linesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Crosstalk reduction between microstrip lines using TL‐shaped defected microstrip structure

2022

Engineering Reports

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“…With the development of the fifth generation communication technology and the progress of integrated circuit technology, the working frequency of electronic equipment has gradually increased from MHz to GHz, and PCB design has to face high-frequency and high-speed issues [1]. On the one hand, the clock frequency of the system continues to increase and the working voltage continues to decrease [2]; on the other hand, a large number of components are integrated into the circuit board, and the layout density of the PCB is increasing, the edge of the signal is becoming steeper and steeper, and the electromagnetic interference (EMI) between transmission lines will become more and more serious [3].…”

Section: Introductionmentioning

confidence: 99%

Design of T-shaped non-uniform microstrip lines for reducing crosstalk in high-speed PCBs

Dong,

Duan,

Xie

2023

J. Phys.: Conf. Ser.

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High-speed and high-density PCB circuit layout design faces serious signal integrity problems. Crosstalk is one of the key problems affecting signal quality. Periodic non-uniform differential microstrip lines have the possibility of reducing crosstalk. This paper proposes a T-shaped non-uniform microstrip line, which adds the T-shaped bump on the inner side of the parallel microstrip lines. The microstrip line adopts the minimum batch production process linewidth to maintain high density, which is suitable for occasions where the line spacing is three times the linewidth. The principle of crosstalk mitigation for T-shaped microstrip lines is explained, and the evolution process of T-shaped microstrip lines is given, compared with parallel microstrip lines and tabbed lines with the same density. The simulation resulting in the time domain and frequency domain shows that the transmission performance of the T-shaped microstrip line is good, and crosstalk can be effectively suppressed in a high-frequency band, even better in some specific frequencies due to the crosstalk fluctuation with frequency.

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Delay and Crosstalk Aware Analysis for High Speed On-Chip Global RLC VLSI Interconnects

Gupta

Maheshwari

Malipatil³

et al. 2021

Lecture Notes in Electrical Engineering

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Analysis of Crosstalk Noise for Coupled Microstrip Interconnect Models in High-Speed PCB Design

Cited by 7 publications

References 9 publications

Crosstalk reduction between microstrip lines using TL‐shaped defected microstrip structure

Crosstalk reduction between microstrip lines using TL‐shaped defected microstrip structure

Design of T-shaped non-uniform microstrip lines for reducing crosstalk in high-speed PCBs

Delay and Crosstalk Aware Analysis for High Speed On-Chip Global RLC VLSI Interconnects

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