Analysis of diamond wheel wear and surface integrity in laser-assisted grinding of RB-SiC ceramics

Abstract

Laser-assisted grinding provides a promising solution for achieving costefficient machining of hard and brittle materials. However, the heat generated by laser may cause the wear of diamond grinding wheel, including the wear of both diamond grits and bond material. Consequently, wheel wear has a knock-on effect on the ground surface roughness. Moreover, the laser irritation may also induce damage in the machined surface. This paper focuses on the investigation of wear of diamond grinding wheel and surface integrity in laser-assisted grinding of RB-SiC ceramics. Different temperatures were obtained by setting the laser power to explore the influence of heat on wheel wear and surface integrity. The wear modes and mechanism of the diamond grits and bond material were analyzed by combination of SEM detection and energy dispersion spectrum analysis. The results revealed that adhesion and pullout of diamond grits in laser-assisted grinding were the remarkable difference from those in conventional grinding due to the thermal softening of both RB-SiC specimen and bond material of the grinding wheel. Surface roughness was then improved owing to the increase in active grits. The Raman spectra of the machined surface also revealed different stress conditions and microstructures of the Si and SiC Phase in RB-SiC ceramics. These results provided insight on quality control in laser-assisted machining of RB-SiC ceramics.

On the creation of structured abrasive tools via multiple-pass rotary wire EDM: A geometrical model

“…To address this, a large number of laser based thermal methods were explored in depth, and the basic principle was the same. A laser beam ablated a specific region of abrasive tools, where materials were removed by gasification, oxidation, melting and decomposition [37,38]. The continuous-wave Nd:YAG laser was employed to successfully generate a series of designed slots on not only superabrasive tools with bronze [39], copper [40], and resin bonds [41,42], but also conventional tools such as Al2O3 wheel [43,44], although obvious Heat Affected Zone (HAZ) can be recognised.…”

Experimental Investigation of Grinding Force and Material Removal Mechanism of Laser-Structured Zirconia Ceramics

“…Pratap et al [ 16 ] investigated the material removal mechanism and analyzed the damage occurrence for parallel as well as intersecting micro grinding. Rao et al [ 17 ] revealed that adhesion and pullout of diamond grits in laser-assisted grinding were remarkable difference from those in conventional grinding due to the thermal softening of both RB-SiC specimen and bond material of the grinding wheel. Kadivar et al [ 18 ] showed that the laser-cut depth could be predicted and choosing optimal laser parameters is possible to achieve a certain laser-cut depth.…”

Process Parameters Optimization Using Taguchi-Based Grey Relational Analysis in Laser-Assisted Machining of Si3N4

“…Extensive research has been conducted on various ceramics and has proved in the past few decades that LAM is effective for machining brittle and hard materials [ 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 ]. In the early 1990s, scholars began to study the LAM of engineering ceramics [ 21 ].…”