Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Abstract

Studies on electromigration phenomenon in thick-film structures on alumina and LTCC substrates are presented in this paper. The effects of storage of Au and Ag electrode patterns in temperature range up to 300°C under voltage bias were examined. The leakage characteristics of electrodes with 100 µm spacing at 50 V dc bias as a function of time and temperature are presented and analyzed. Scanning electron microscope (SEM) equipped with the energy-dispersive X-ray spectroscopy (EDX) detector was applied for determination of metal ions transport. Test structures with Au-based conductive material are much more resistant to electromigration than Ag-based layers.

Analysis of long-term stability of capacitors embedded in printed circuit boards

“…To analyze stability of electronic components an accelerated ageing process can be used. Treating resistors or capacitors with elevated temperature (and/or humidity) allows (in quite short time) obtain long-term behaviour of tested samples referred to a few years of service [1][2][3][4][5][6][7][8]. Knowing the importance of this issue authors undertook extensive research of reliability of above embedded passives.…”