Analysis of heating mechanisms in capacitively-coupled plasma using PIC simulation

Kim, H.C.; Manuilenko,; Chung, Tung-Hsun; Lee, J.K.; Shon, J. W.

doi:10.1109/plasma.2003.1228600

The 30th International Conference on Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts.

DOI: 10.1109/plasma.2003.1228600

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Analysis of heating mechanisms in capacitively-coupled plasma using PIC simulation

H.C. Kim

Manuilenko Manuilenko

Tung-Hsun Chung

et al.

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Analysis of heating mechanisms in capacitively-coupled plasma using PIC simulation

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