Analysis of III crack in a finite plate of functionally graded piezoelectric/piezomagnetic materials using boundary collocation method

Jia-xing, Cheng; Sun, Bin; Wang, Mengyun; Li, Zhaoxia

doi:10.1007/s00419-018-1462-y

Cited by 9 publications

(2 citation statements)

References 25 publications

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“…It provides a new attempt and is effective for solving fracture problems of MEE solids and structures of thin domains. Cheng et al [15] evaluated the influence of the MEE load and gradient parameters on the crack tip singularity in a FGMEE rectangular plate through boundary collocation method employed. The above articles are all researched based on the BEM.…”

Section: Introductionmentioning

confidence: 99%

“…The first two BCs are the most widely used. The permeable BC [15,21] does not consider the influence of the internal magnetoelectric medium (such as air) after the crack opens, and it is believed that the upper and lower surfaces of the crack are in magnetoelectric contact. The impermeable BC [2,5,9,18,22] considers that the upper and lower surfaces of the crack are electromagnetically insulated, i.e., the magnetic permeability and the permittivity of the medium inside the crack are zero.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Dynamic fracture behavior for hole-initiated cracks in functionally graded magneto-electro-elastic bi-materials

An,

Chen,

Zhang

et al. 2023

Mathematics and Mechanics of Solids

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In this article, the dynamic fracture behavior of hole-initiated cracks in functionally graded magneto-electro-elastic (FGMEE) bi-materials with exponential variation is studied by Green’s function method, and SH-wave is considered as an external load acting on the bi-materials. The mechanical model of the cracks is constructed through interface-conjunction and crack-deviation techniques, thereby simplifying the crack problem to solving a series of the first kind of Fredholm’s integral equations, from which the dynamic stress intensity factor (DSIF) at the crack tips is expressed. Numerical results clarified the factors that affect the DSIF, including wave number, incident angle, the geometry of the defect, and the gradient of the bi-materials. The accuracy of the present methods is examined by comparing the obtained results with the reference solutions. Compared with previous traditional numerical and analytical methods, the methods proposed in this paper are relatively more effective and applicable, and provide a new perspective for studying the fracture problems of FGMEE materials with more complex defects in practical engineering.

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Section: Introductionmentioning

confidence: 99%