Analysis of Long-Term Change in the Thermal Resistance of Extruded Insulation Materials through Accelerated Tests

Abstract

Two experiments were executed to examine the slice accelerated test method, suggested in ISO 11561 “Ageing of thermal insulation materials—Determination of the long-term change in thermal resistance of closed-cell plastics (accelerated laboratory test methods)” and to observe the changes in the thermal performance of insulation material over time by the real-time ageing process. The accelerated test method was conducted for 120 consecutive days using 10 mm thick-sliced specimens, which were sampled from a 50 mm thick plate body. The real-time ageing process was performed for 5000 consecutive days under constant temperature and relative humidity conditions as of 20 ± 5 °C and 50 ± 5% without any slicing. Degradation of thermal performance was shown to be stabilized at around 38 to 41% down from the initial values, which were correspondent with the approximately 10 days after the initial time. The real-time ageing process revealed similar degradation levels at around 130 days after the starting point. Converting the results using the scaling method specified in ISO 11561, the change was found in the range of 37 to 41% for the thermal resistance after 25 years and of 30 to 38% for the 25-year-average thermal resistance, respectively. Within the 10% error range, both the accelerated method and real-time ageing resulted in a similar level of degradation. Consequently, it was our observation that the slice accelerated test was quite enough to predict the practical degradation of insulation materials with at least 90% of accuracy under the specified time duration, temperature and thickness satisfactions.

Development of an Innovative Lightweight Composite Material with Thermal Insulation Properties Based on Cardoon and Polyurethane

“…As is known, thickness has a determinant contribution to the thermal conductivity of materials and it should be taken into account when insulation capacity is being compared [ 51 , 52 ]. Therefore, to better compare the insulation capacity of the developed composite material with the conventional solutions, the thermal resistance (R) of all materials was calculated according to Equation (1) [ 51 , 52 ]: where λ 20 °C is the thermal conductivity coefficient at 20 °C (W m −1 K −1 ) and t is the thickness (m) of each material. Moreover, the thickness required to achieve a thermal resistance equivalent to rockwool and EPS was also determined for each material.…”

“…As is known, thickness has a determinant contribution to the thermal conductivity of materials and it should be taken into account when insulation capacity is being compared [51,52]. Therefore, to better compare the insulation capacity of the developed composite material with the conventional solutions, the thermal resistance (R) of all materials was calculated according to Equation (1) [51,52]: As can be observed, the developed composite material has lower thermal conductivity than plasterboard and oriented strand board (OSB) for all studied temperatures (Table 2). However, EPS and rockwool reached much lower values (Table 2).…”

“…As is known, thickness has a determinant contribution to the thermal conductivity of materials and it should be taken into account when insulation capacity is being compared [51,52]. Therefore, to better compare the insulation capacity of the developed composite material with the conventional solutions, the thermal resistance (R) of all materials was calculated according to Equation (1) [51,52]:…”

Tracking Resistance in Polymeric Insulation Materials for High-Voltage Electrical Mobility Applications Evaluated by Existing Test Methods: Identified Research Needs

“…One of the major concerns with polymeric insulation materials is their life expectancy, especially in outdoor environments, which results in thermal [ 84 ], mechanical and dielectric degradation [ 85 ] over time. In a study conducted on polymer films [ 86 ], it was shown that for a given film thickness, the aging rate increases with the ambient temperature due to the higher mobility of the charge carriers.…”