1993 IEEE MTT-S International Microwave Symposium Digest
DOI: 10.1109/mwsym.1993.276749
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Analysis of microstrip lines coupled through an arbitrarily shaped aperture in a thick common ground plane

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Cited by 11 publications
(2 citation statements)
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“…There are two main techniques for a transition between microstrip lines in multilayer technology. One employs an electrical contact and the other use electromagnetic coupling [28][29][30][31]. One type uses vias to connect the top layer microstrip ground planes with the lower microstrip ground plane and the other does not.…”
Section: Microstrip Slot-coupled Transitionmentioning
confidence: 99%
See 1 more Smart Citation
“…There are two main techniques for a transition between microstrip lines in multilayer technology. One employs an electrical contact and the other use electromagnetic coupling [28][29][30][31]. One type uses vias to connect the top layer microstrip ground planes with the lower microstrip ground plane and the other does not.…”
Section: Microstrip Slot-coupled Transitionmentioning
confidence: 99%
“…The transitions using via holes are compact and broadband, but the vias can cause parasitic inductance and are difficult to be fabricated [29]. In other hand, the transitions by electromagnetic coupling require no wire bonds or via holes [29][30][31]. In this perspective, printed slots have been preferred to be versatile for vertical transitions.…”
Section: Microstrip Slot-coupled Transitionmentioning
confidence: 99%