Analysis of power/ground noises and decoupling capacitors in printed circuit board systems

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

“…Characterizing the lossy conductor by its surface impedance Z s , then the total electric field and surface current density J s (r) satisfy the following impedance boundary condition over the conductor surfaces: (4) Also, the surface charge q s (r), surface current J s (r), and the external current flowing into the ports of the conductors, J i , satisfy the general continuity relation: (5) Combining the boundary condition with continuity equation, we have the following set of mixed potential integral equations: (6) (7) (8) where S is the conductor surfaces and . This set of integral equations completely describes the potential, current, and charge distributions on the power and ground conductor planes.…”

“…This methodology has been implemented and applied to practical design problems. It should be able to handle the complexity of real IC/ MCM/PCB designs within the practical computational constraints of an engineering workstation environment [7,8].…”

“…On the other hand, due to the overwhelming complexity of digital circuit board, full-wave rigorous electromagnetic field solutions, such as those used in microwave analysis [4], become impractical for digital application because of the extremely high computational requirement, and the difficulty of integrating with time-domain circuit type simulators and design environments used by digital designers. Therefore, EM modeling and simulation methodologies that can handle large complex digital designs with reasonable accuracy and efficiency, and can provide good macro models over extended frequency bands, are very much desired and thus present a challenge to us [5][6][7][8].…”

“…On the other hand, due to the overwhelming complexity of digital circuit board, full-wave rigorous electromagnetic field solutions, such as those used in microwave analysis [4], become impractical for digital application because of the extremely high computational requirement, and the difficulty of integrating with time-domain circuit type simulators and design environments used by digital designers. Therefore, EM modeling and simulation methodologies that can handle large complex digital designs with reasonable accuracy and efficiency, and can provide good macro models over extended frequency bands, are very much desired and thus present a challenge to us [5][6][7][8].This paper presents a systematic approach which includes an efficient method for the electromagnetic modeling of packages and power/ground structures, and an integrated process for the analysis and simulation of system signal integrity and SSN effect in practical digital designs. The focus of this work is to develop a fast, flexible and accurate electromagnetic model with a clear circuit interpretation for the power/ground network, and to integrate it with active device models, transmission line networks, and chip package parasitics in a time domain co-simulation scheme.…”

“…This methodology has been implemented and applied to practical design problems. It should be able to handle the complexity of real IC/ MCM/PCB designs within the practical computational constraints of an engineering workstation environment [7,8].The paper is organized as follows: In Section 3, the electromagnetic modeling and analysis is presented. The general interconnects and power/ground structures are modeled as a multi-layered dielectric embedded with conductors.…”