Analysis of solder bump position affecting stress performance by the finite element method

Abstract

Due to the smaller size of HDD, fault deformation of solder bumps is found more often. In order to study about a factor relating to fault deformation of solder bumps, the FEM is used to investigate stress performance. The results show that a small number of bumps positioned in a symmetric form have similar stress while a small number of bumps positioned in the asymmetric form have different stress. The results also show that a large number of bumps positioned in the symmetric form also have different stress. Bumps positioned at the corner have highest stress while bumps positioned at the center have lowest stress. The FEM and analytical method are found to be suitable for this study.