Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Elger, Gordon; Kandaswamy, Shri Vishnu; Liu, E.; Hanß, Alexander; Schmid, Maximilian; Derix, Robert; Conti, Fosca

doi:10.1016/j.mejo.2015.08.007

Cited by 43 publications

(7 citation statements)

References 12 publications

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“…Equation ( 3) is used on all, and the normalization is performed in an interval from 100 to 1000 µs. The region of interest is the highest peak, where an increase of 0.05 can be interpreted as a failure [43][44][45]. Zth(t) is calculated afterward from ΔTJ(t) and the power step from PHeat to PSense with Equation ( 1), and it is the basis for any evaluation in TTA.…”

Section: Transient Thermal Analysis (Tta)mentioning

confidence: 99%

“…An exemplary evaluation of the data can be seen in Figure 4b with the same dataset as in Figure 4a. Equation ( 3) is used on all, and the normalization is performed in an interval from 100 to 1000 µ s. The region of interest is the highest peak, where an increase of 0.05 can be interpreted as a failure [43][44][45].…”

Section: Transient Thermal Analysis (Tta)mentioning

confidence: 99%

“…Figure 4. Evaluation methods in TTA: (a) Z th evaluation and (b) normalized logarithmic derivative.Data are generated by an optimized FEM model in a transient thermal simulation with a crack growth of 10% or 30% in the solder joint compared to its area described in[44]. An increase of 0.63 K/W or 2.37 K/W was observed in Z th (t) and 0.012 or 0.044 in peak increase for B(z).…”

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confidence: 99%

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Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics

et al. 2020

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Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to malfunctions with costly or even life-threatening consequences. To avoid or at least reduce failures, nondestructive testing (NDT) methods are common within development and production of power and opto-electronics. Currently, the dominating NDT methods are X-ray, scanning acoustic microscopy (SAM), and transient thermal analysis (TTA). However, they have different strengths and weaknesses with respect to materials and mechanical designs. This paper compares these NDT methods for different interconnect technologies, i.e., reflow soldering, adhesive, and sintered interconnection. While X-ray provided adequate results for soldered interfaces, inspection of adhesives and sintered interconnects was not possible. With SAM, evaluation of adhesives and sintered interconnects was also feasible, but quality depended strongly on the sample under test. TTA enabled sufficiently detailed results for all the interconnect applications. Automated TTA equipment, as the in-house developed tester used within this investigation, enabled measurement times compatible with SAM and X-ray. In the investigations, all methods revealed their pros and cons, and their selection has to depend on the sample under tests and the required analysis depth and data details. In the paper, guidelines are formulated for an appropriate decision on the NDT method depending on sample and requirements.

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Section: Transient Thermal Analysis (Tta)mentioning

confidence: 99%

Section: Transient Thermal Analysis (Tta)mentioning

confidence: 99%

mentioning

confidence: 99%

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Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics

et al. 2020

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“…In order to ensure the accuracy of the calculation results and the reasonableness of the calculation scale, the influences of combination reaction of solder mask, pad, and solder are ignored in modeling. At the same time, we assume that the package component is ideal [18,19,35,36]. Before the fatigue test, the residual stress of the test piece is eliminated through vibration aging method, according to GB/T 25712-2010 [37], so we do not consider the effect of residual stress during simulation.…”

Section: Finite Element Simulationmentioning

confidence: 99%

Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress

Jing

2020

Materials

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The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip solder joints as the study object. First, solder joint degradation data and failure samples were obtained through fatigue tests under coupled stress. Three types of micro failure modes of solder joints were obtained by scanning electron microscope (SEM) analysis and finite element model (FEM) simulation results. Second, the characterization of degradation data was obtained by the principal component of Mahalanobis distance (PCMD) algorithm. It is found that solder joint degradation is divided into three stages: strain accumulation stage, crack propagation stage, and failure stage. Later, Coffin–Manson model and Paris model were modified based on the PCMD health index and strain simulation. The function relationship between strain accumulation time, crack propagation time, and strain was determined, respectively. Solder joint degradation models at different degradation stage were established. Finally, through strain simulation, the models can predict the strain accumulation time and failure time effectively under each failure mode, and their prediction accuracy is above 85%.

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“…Instead of liquid flux we have operated in gaseous formic acid. 16,17 In Fig. 1 the solder paste SAC305 is shown with (right) and without (left) reductive formic acid vapour.…”

Section: Introductionmentioning

confidence: 99%

Thermogravimetric investigation on the interaction of formic acid with solder joint materials

et al. 2016

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Soldering is a dominating process for semiconductor packaging. For electronic manufacturing tin based solders play a key role. The surface of most solder alloys is oxidized under an oxygen containing atmosphere. Usually reducing chemicals, called fluxing agents, are used to enable the formation of solder contacts. However, standard liquid flux leaves aggressive residues on the electronic devices. Clean processes were developed using gaseous flux, i.e. formic acid vapor. Despite the competitiveness of the reducing effect of formic acid vapour on many solder alloys, only little is known about the corresponding reaction mechanism, especially at the surface. An oxidized copper powder and a tin silver copper alloy were investigated using thermogravimetric and mass spectra analysis under formic acid flow. Details on the adsorbed and desorbed species and the formation of intermediates and decomposition products are presented. Activation temperatures are estimated and correlated with heating processes

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Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Cited by 43 publications

References 12 publications

Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics

Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics

Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress

Thermogravimetric investigation on the interaction of formic acid with solder joint materials

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