Analysis of subsurface damage inhibition in magnetization-enhanced force-rheological polishing

Dongdong, Zhou; Huang, Xiaoxue; Li, Xiyang; Yang, Ming

doi:10.1016/j.triboint.2022.108105

Cited by 4 publications

(1 citation statement)

References 61 publications

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“…Sun et al [12] examined large-sized cerium-oxide polished quartz glass samples using confocal laser scanning and 3D reconstruction techniques, their SSD measurement being 29 μm. Zhou et al [13] developed an SSD prediction model for magnetorheological finishing (MRF)-polished SiC molds and analyzed the influence of different factors on the SSD during the polishing process. The model calculations showed a maximum deviation of less than 7% compared to the actual results.…”

Section: Introductionmentioning

confidence: 99%

Surface and subsurface damage of fused quartz glass induced by shear-thickening polishing

Wang,

He,

Liu

et al. 2024

Surf. Topogr.: Metrol. Prop.

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Fused quartz glass is widely used in the civil and national defense fields. Shear-thickening polishing (STP) technology is highly efficient for processing quartz glass. However, the surface and subsurface damage (SSD) caused by STP have yet to be studied. In this study, the SSD characteristics of quartz glass after STP were examined using chemical etching and nanoindentation tests. The Sa (average roughness) of the fused quartz glass after 30 min of STP was 1.6 nm and the embedded depth of impurities was approximately 30 nm. The 3D morphology of the Beilby layer was sensitive to the chemical etching time, disappearing when the etching time was 120 s (at which point the Beilby layer with a depth ranging from 97 to 144 nm was completely removed). From various analysis methods, it can be inferred that the SSD depth was between 4.8–6.7 µm. To confirm that the above SSD came from the grinding or STP process, the polished fused silica glass was etched for 150 min to remove the SSD, after which it was polished for 30 min to regain its smooth surface; the workpieces were then etched again and the Sa and 3D morphology were compared with the workpiece which had no damage removal. The results showed that STP did not introduce new SSD and was a near-lossless polishing technique under the conditions used in this study. STP can achieve an extremely low surface roughness, efficiently; however, the depth of material removal is insufficient, and the SSD caused by the grinding process remains.

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Section: Introductionmentioning

confidence: 99%

Surface and subsurface damage of fused quartz glass induced by shear-thickening polishing

Wang,

He,

Liu

et al. 2024

Surf. Topogr.: Metrol. Prop.

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Modeling and prediction of surface topography and surface roughness in magnetic-field-enhanced shear-thickening polishing of SiC mold

Dongdong

Huang

Yang

et al. 2023

Tribology International

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Theoretical and Experimental Investigation of Material Removal Rate in Magnetorheological Shear Thickening Polishing of Ti–6Al–4V Alloy

Tian,

Ma,

Ahmad

et al. 2023

Journal of Manufacturing Science and Engineering

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Magnetorheological shear thickening polishing (MRSTP) is a novel multi-field compound polishing method that combines the shear-thickening effect and the magnetorheological effect. It has great potential as an ultra-precise machining for complex surfaces. However, there is absence of the correlation between the material removal and the rheological properties of the polishing media leads to difficulties for further improvement in polishing efficiency and quality in MRSTP. In this paper, the material removal model for MRSTP was established based on magneto-hydrodynamics, non-Newtonian fluid kinematics and microscopic contact mechanics. It combines the material removal model for single abrasive and statistical model of active abrasives. On comparing the experimental and theoretical results, it showed that the developed material removal model can accurately predict the material removal depth of the workpiece under different processing parameters (rotational speed of rotary table and magnetic field strength). The average prediction error was less than 5.0%. In addition, the analysis of the rheological behavior and fluid dynamic pressure of the polishing media reveals the coupling effect between the magnetic, stress and flow fields. This provides theoretical guidance for the actual processing of MRSTP. Finally, the maximum material removal rate of 3.3 μm/h was obtained on the cylindrical surface of the Ti-6Al-4V workpiece using the MRSTP method. The result shows that the MRSTP method has great potential in the field of ultra-precision machining of difficult-to-machine materials.

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Analysis of subsurface damage inhibition in magnetization-enhanced force-rheological polishing

Cited by 4 publications

References 61 publications

Surface and subsurface damage of fused quartz glass induced by shear-thickening polishing

Surface and subsurface damage of fused quartz glass induced by shear-thickening polishing

Modeling and prediction of surface topography and surface roughness in magnetic-field-enhanced shear-thickening polishing of SiC mold

Theoretical and Experimental Investigation of Material Removal Rate in Magnetorheological Shear Thickening Polishing of Ti–6Al–4V Alloy

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