2014
DOI: 10.1063/1.4893970
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Analysis of temperature dependent current-conduction mechanisms in Au/TiO2/n-4H-SiC (metal/insulator/semiconductor) type Schottky barrier diodes

Abstract: Frequency and gate voltage effects on the dielectric properties and electrical conductivity of Al/SiO2/p-Si metalinsulator-semiconductor Schottky diodes Fabrication and properties of metal/ferroelectrics/semiconductor diodes on 4H-SiC Appl.In order to determine the effective current-conduction mechanisms in Au/TiO 2 /n-4H-SiC (metalinsulator semiconductor) type Schottky barrier diodes (SBDs), their current-voltage (I-V) measurements were carried out in the temperature range of 200-380 K. Some electrical parame… Show more

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Cited by 74 publications
(25 citation statements)
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“…The origin of R s can arise from five different sources: (1) the rectifier contact made by the probe wire and ohmic back contact to the semiconductor; (2) an interfacial layer native or deposited between metal and semiconductor; (3) the resistance of the quasi-neutral bulk semiconductor between the back/rectifier contact to the semiconductor and the depletion layer edge at the semiconductor surface underneath the gate; (4) an extremely non uniform doping distribution of donor or acceptor atoms in the semiconductor underneath the gate; (5) the particular density distribution of N ss between Metal and Semiconductor [12,14]. When the forward bias is applied on the diode, while the most of this voltage drops in the depletion layer, remaining voltage is shared by the semiconductor bulk, R s , the interfacial dipole and interfacial layer (native or deposited).…”
Section: Introductionmentioning
confidence: 99%
“…The origin of R s can arise from five different sources: (1) the rectifier contact made by the probe wire and ohmic back contact to the semiconductor; (2) an interfacial layer native or deposited between metal and semiconductor; (3) the resistance of the quasi-neutral bulk semiconductor between the back/rectifier contact to the semiconductor and the depletion layer edge at the semiconductor surface underneath the gate; (4) an extremely non uniform doping distribution of donor or acceptor atoms in the semiconductor underneath the gate; (5) the particular density distribution of N ss between Metal and Semiconductor [12,14]. When the forward bias is applied on the diode, while the most of this voltage drops in the depletion layer, remaining voltage is shared by the semiconductor bulk, R s , the interfacial dipole and interfacial layer (native or deposited).…”
Section: Introductionmentioning
confidence: 99%
“…For MS-or MIS-type SBDs, according to the TE theory, the relation between I and V (V ≥ 3kT/q) can be expressed as [1][2][3][24][25][26][27][28][29][30][31]:…”
Section: Resultsmentioning
confidence: 99%
“…Although there are many studies both theoretical and experimental on these devices, their conduction mechanisms and the formation of barrier height (BH) at MIS interface have not been clarified yet [1][2][3][4][5][6][7][8][9]. At any specific, especially low-temperature and -voltage, interval several conduction mechanisms can be individually dominating or collectively operative.…”
Section: Introductionmentioning
confidence: 99%
“…In general, polarization mechanisms at low frequencies are affected by electronic, ionic, dipolar and interface or surface polarization distribution [24,25]. The high values of ε and ε investigated at low frequencies may be attributed to interfacial Maxwell-Wagner polarization [26] and space charge polarization [27].…”
Section: Frequency Dependence Of Dielectric Propertiesmentioning
confidence: 99%
“…The complex impedance Z * or the complex permittivity ε * = 1/M * data are transformed into the M * formalism using the following relation [11,[26][27][28].…”
Section: Frequency Dependence Of Dielectric Propertiesmentioning
confidence: 99%