Abstract:The performance and reliability of silicon-based hetero-structure devices depend critically on their interfacial characteristics. Here we present high-resolution TEM (HRTEM) results for the a-SiC:H/c-Si (100) interface, substrate doping, and interface electrical characteristics derived from an Al/undoped a-SiC:H/p-Si metal-insulator-semiconductor (MIS) structure. The HRTEM study reveals an interface with a maximum asperity of three atomic planes. The substrate dopant profile for depths less than an extrinsic D… Show more
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