Analysis of the characteristics of thick-film NTC thermistor devices manufactured by screen-printing and firing technique and by room temperature aerosol deposition method (ADM)

Abstract

The study compares thick-film NTC thermistor devices, produced by the screen-printing (and firing) technique and by the Aerosol Deposition Method (ADM) at room temperature. The devices are compared with respect to film quality (optical, mechanical) and to the negative temperature coefficient of resistance (NTCR) parameters [Formula: see text] and [Formula: see text]. While the screen-printed films are porous, the Aerosol Deposited (AD) films are characterized by high tightness, mechanical stability, and a production at room temperature. The electrical analysis shows that the AD films reach the [Formula: see text]- and [Formula: see text]-values of bulk NTCRs from literature after a moderate tempering step below 400[Formula: see text]C in air. The screen-printed films show [Formula: see text]-values that are comparable to the values of bulk NTCRs from literature and [Formula: see text]-values that are significantly higher.

Thermal Treatment of Aerosol Deposited NiMn2O4 NTC Thermistors for Improved Aging Stability

“…They yield to distortions in the crystal lattice and thus influence the hopping processes of the charge carriers. The study of the tempering behavior confirms the existing observation [15,17,19,20] that both B and R 25 are reduced by moderate tempering of AD-NiMn 2 O 4 films. However, the study shows further effects.…”

“…A new approach to produce film-based NTCR devices utilizes the Aerosol Deposition Method (ADM) [15,16,17,18,19,20]. With this novel spray coating process, dense ceramic NTCR films can be produced at room temperature and directly from a ceramic spinel-based starting powder on various substrate materials [21,22].…”

“…With this novel spray coating process, dense ceramic NTCR films can be produced at room temperature and directly from a ceramic spinel-based starting powder on various substrate materials [21,22]. The deposited NTCR films are characterized by a nanocrystalline film structure, a high density, good substrate adhesion and a film thickness between 0.5 µm and 5 µm [15,16,17,18,19,20]. The electrical properties of the NTCR films are similar to those of the traditionally produced bulk-based NTCR ceramics and can be improved by moderate film tempering up to 600 °C [19].…”

Powder aerosol deposition method — novel applications in the field of sensing and energy technology

“…62 Schubert et al carried out further investigations on the PAD of spinel-based NiMn 2 O 4 ceramics. 30,63,64 Besides the development of chip-based components (see Fig. 4), 63,64 these authors were focusing on tempering 30,63 and aging 63 of NTCR films.…”

“…30,63,64 Besides the development of chip-based components (see Fig. 4), 63,64 these authors were focusing on tempering 30,63 and aging 63 of NTCR films. They attributed the known tempering effect to a reduction of microstrain and crystallite growth and showed a significant improvement in aging stability.…”