Analysis of the Compression Behavior of Different Cardboard Materials During Embossing

Abstract

Embossing is an important design and functionality element. For instance, embossing is used to apply braille letters on medical products, or to enhance folding packages or brochures due to haptic effects. Usually, a multilayered cardboard material is used for such types of products. Up to now, high-quality and functional embossing has so far been associated with an extraordinarily large amount of experience-based know-how and with many cost-intense trial-and-error experiments due to the mechanical complexity of cardboard material. In the presented work it is shown how experimental investigations and numerical simulations based on Finite-Element-Analysis can contribute to a virtual prediction of the embossing process and, therefore, can help to reduce time-consuming and expensive experiments.

Investigation of different cardboard materials under impact loads

“…For low strain rates, Garbowski et al (2012) analyzed the orthotropic deformation behavior of paper foils by means of biaxial tests. Furthermore, Kaeppeler et al (2022) measured the compaction of cardboard materials. They used an orthotropic elastic constitutive model and Hill yield criterion for the description of the anisotropic plastic deformations to approximate the inelastic deformation behavior.…”