Analysis of the Copper Electrodeposition Current Transients in Nitrates Media

Aguilar-Sánchez, M.; Palomar-Pardavé, M.; Corona-Avendaño, S.; Romero-Romo, M.; Ramírez-Silva, Teresa; Scharifker, B.R.; Mostany, Jorge; Rodríguez, Israel

doi:10.1149/1.3268403

Cited by 6 publications

(4 citation statements)

References 19 publications

(32 reference statements)

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“…N0 increases with ηSEI in all the studied range due to the enhancement of kPR. A also increases with ηSEI but does not follow the exponential tendency reported in other work [53,54,55] or the dependency described by Sebastián et al…”

Section: Analysis Of the CV And The Current-density Transientscontrasting

confidence: 59%

Electrodeposition of Bi films on H covered n-GaAs(111)B substrates

Prados

Ranchal

2019

Electrochimica Acta

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We have investigated how the presence of an adsorbed hydrogen layer affects the nucleation and properties of Bi layers grown by dc electrodeposition at different overpotentials on n-GaAs(111)B substrates with a carrier concentration of 1.3 •10 17 cm -3 in darkness and at 300 K. The kinetics of Bi(III) ions reduction is controlled by the overpotential but also negatively affected by the adsorbed hydrogen layer, as deduced from the deconvolution of the current density transients recorded during the nucleation of the films.The surface morphology and the structural properties of the Bi films are correlated with the nucleation process and therefore, influenced by both the overpotential and the adsorbed hydrogen layer. At low overpotentials, porous and rough Bi films with a low crystal quality are obtained due to the low rate of proton and Bi(III) ion reduction. As the overpotentials raises, the rate of these reactions increase leading to flatter and more compact Bi films with a higher crystal quality. The electrical properties of the Bi/n-GaAs interface depend on the interfacial states whose origin is again the combined effect of the adsorbed hydrogen layer and growth overpotential.

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Section: Analysis Of the CV And The Current-density Transientscontrasting

confidence: 59%

Electrodeposition of Bi films on H covered n-GaAs(111)B substrates

Prados

Ranchal

2019

Electrochimica Acta

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“…For the deposition of Cu, the reduction sweep on the voltammogram (Figure 3b) shows a broad feature starting at ~−0.15 V, described by the following equation [22,23]: Cu2++2e−→ Cu…”

Section: Resultsmentioning

confidence: 99%

Formation of 3-Dimensional Gold, Copper and Palladium Microelectrode Arrays for Enhanced Electrochemical Sensing Applications

2019

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Microelectrodes offer higher current density and lower ohmic drop due to increased radial diffusion. They are beneficial for electroanalytical applications, particularly for the detection of analytes at trace concentrations. Microelectrodes can be fabricated as arrays to improve the current response, but are presently only commercially available with gold or platinum electrode surfaces, thus limiting the sensing of analytes that are more electroactive on other surfaces. In this work, gold (Au), copper (Cu), and palladium (Pd) are electrodeposited at two different potentials into the recessed holes of commercial microelectrode arrays to produce 3-dimensional (3D) spiky, dendritic or coral-like structures. The rough fractal structures that are produced afford enhanced electroactive surface area and increased radial diffusion due to the 3D nature, which drastically improves the sensitivity. 2,4,6-trinitrotoluene (TNT), carbon dioxide gas (CO2), and hydrogen gas (H2) were chosen as model analytes in room temperature ionic liquid solvents, to demonstrate improvements in the sensitivity of the modified microelectrode arrays, and, in some cases (e.g., for CO2 and H2), enhancements in the electrocatalytic ability. With the deposition of different materials, we have demonstrated enhanced sensitivity and electrocatalytic behaviour towards the chosen analytes.

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“…To understand and optimize the mechanism of electroplating, we employed a series of reductive potentiostatic steps, proven to be a robust technique to elucidate the formation of metallic phases during electrodeposition [57,59,60]. Our experimental chronoamperormetric results prove to be quite stable, thus allowing further theoretical nucleation analysis; an extract of the obtained data for the CA study can be seen in Figure 2 where the baseline electrolyte and the boric acidmodified electrolyte are shown, at 50 and 800 mV.…”

Section: Chronoamperometric Iron Electrodeposition Studymentioning

confidence: 99%

Elucidating the Influence of Electrolyte Additives on Iron Electroplating Performance

Gimenez-Garcia,

Forner-Cuenca

2024

Preprint

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Iron electroplating is a process of great interest for many large-scale industrial and emerging energy applications, such as all-iron redox flow batteries. However, the process efficiency and material lifetime are greatly conditioned and limited by the poorly understood plating process and the presence of competitive reactions. In this work, we propose a methodology to deconvolute the nucleation parameters of iron via a suite of electrochemical techniques, spectroscopy, and analytical models, coupled with microscopic and crystallographic techniques. We perform a systematic analysis with iron-based electrolytes to deconvolute the simultaneous plating and hydrogen evolution reactions, and investigate an array of additives to tune electroplating descriptors. We find that all additives studied are able to regulate the plating process and find that highly stable iron-complexes based on buffers, such as iron-borates or -citrates deliver greater overall electroplating performance. These additives show superior selectivity, with improvements in faradaic efficiencies from 60% to ~90% due to the balanced effects of enhanced nucleation and side reaction suppression. Herewith, the aim of this study is to bridge the knowledge gap between the role of additives, kinetics and efficiency of the electrodeposition reaction, and their interplay defining the quality of the resulting plated layers.

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Analysis of the Copper Electrodeposition Current Transients in Nitrates Media

Cited by 6 publications

References 19 publications

Electrodeposition of Bi films on H covered n-GaAs(111)B substrates

Electrodeposition of Bi films on H covered n-GaAs(111)B substrates

Formation of 3-Dimensional Gold, Copper and Palladium Microelectrode Arrays for Enhanced Electrochemical Sensing Applications

Elucidating the Influence of Electrolyte Additives on Iron Electroplating Performance

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