Analysis of the high-efficiency and low-damage abrasive processing mechanism for SiC based on the SPH simulation of single-grain indentation and scratching

Shi, Dong; Hou, Qingming; Ma, Tengfei; Zhao, Tianchen; Pan, Jinping

doi:10.1063/5.0076269

Cited by 3 publications

(2 citation statements)

References 27 publications

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“…In this study, the transient structural analysis was used as an alternative to the explicit dynamics method for simulating the scratch test to save time and minimize expenses. However, recent research has been actively exploring the application of a method using Smooth-Particle Hydrodynamics (SPH) coupled with the Finite Element Method (FEM) for grinding [28][29][30][31]. This method offers the advantages of time efficiency for slow behavior and the ability to simulate realistic behavior.…”

Section: Finite Element Analysis (Fea)mentioning

confidence: 99%

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

2023

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Lithium tantalite (LiTaO3) is a representative multifunctional single-crystal material with electro-optical, acoustic, piezoelectric, pyroelectric, and nonlinear optical properties used as a substrate for surface acoustic wave (SAW) devices. To enhance SAW device performance, thinner LiTaO3 substrates with improved surface roughness are desired. Chemical mechanical polishing (CMP) is employed to achieve the desired surface roughness after grinding. However, the thinning process increases the risk of substrate fracture, especially at the edges, resulting in edge chipping. Edge chipping can lead to complete substrate failure during SAW device fabrication, requiring an effective wafer geometry to prevent it. The study utilizes scratch tests and finite element analysis (FEA) to identify the optimal edge shape (C-cut, trimmed, and thinned) for preventing edge chipping on LiTaO3 wafers. The C-cut edge refers to the rounding of the wafer’s edge, while the trimmed edge refers to the machining of the wafer’s edge to be perpendicular to the wafer surface. As a result of the scratch tests, we observed edge-chipping lengths of 115 and 227 μm on the C-cut and trimmed edges, respectively, while the thinned edge (half C-cut) resulted in complete wafer fracture. In the finite element analysis (FEA), edge-chipping lengths of 80, 120, and 150 μm were obtained on the C-cut, trimmed, and thinned edges (half C-cut), respectively. In conclusion, it has been confirmed that the C-cut, trimmed, and thinned edge shapes are effective in preventing edge chipping. However, considering that the C-cut edge shape becomes thinner through grinding, using the trimmed edge shape appears to be the most effective.

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Section: Finite Element Analysis (Fea)mentioning

confidence: 99%

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

2023

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“…Two scratching experiments are conducted under three different conditions to verify the validity of the simulation method. Shi et al [19] adopted the SPH method to simulate the single abrasive scratching of SiC wafers to investigate the micromechanical mechanisms affecting the parameters during SiC grinding processing, and the results showed that higher velocity can reduce the subsurface damage and surface roughness. Higher scratch depths caused larger surface defects and damage.…”

Section: Introductionmentioning

confidence: 99%

Study on grinding removal mechanism and subsurface damage of bionic layered graphene ceramic matrix composites

Zhou,

Zou,

Zhang

et al. 2024

Int J Adv Manuf Technol

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Bionic layered graphene ceramic matrix composites have excellent properties of high strength, high toughness and heat resistance, and are important materials for national defense equipment, but they are also typical brittle and difficult-to-machine materials. To achieve high quality and low damage machining of the composite parts, grinding removal mechanism and subsurface damage are investigated in this paper. Firstly, the SPH simulation models for indentation and scratching of a single diamond grain are established. The effect of addition of graphene nanosheets on the crack expansion mechanism and subsurface damage is investigated. Then, the simulation models of different angles of graphene nanosheets are established to analyze the effect of graphene anisotropy on grinding process of composites. Finally, the grinding removal mechanism of the composites is investigated by analysing crack expansion and removal forms of the composites at different scratching velocities and depths. The results show that incorporation of graphene nanosheets can reduce subsurface damage of composites and provide a certain shielding effect on the cracks. The optimal effects for reducing subsurface damage and cracks are obtained when graphene nanosheets angle is 0°. As scratching depth increases, the material removal mode gradually changes from plastic removal to brittle removal, and subsurface damage and crack depths also increases. The increase in scratching velocity leads to a subsequent increase in material strain rate, which inhibits crack generation and reduces subsurface damage depth. The form of material removal and crack generation in scratching experiments is consistent with the simulation analysis when changing the scratching depth.Furthermore, the effect of graphene nanosheets on crack deflection corresponds with the simulation results. This study can provide an important theoretical basis for the grinding process of bionic layered graphene ceramic matrix composite parts.

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Study on grinding removal mechanism and subsurface damage of bionic layered graphene ceramic matrix composites

Zhou,

Zou,

Zhang

et al. 2023

Preprint

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Bionic layered graphene ceramic matrix composites have excellent properties of high strength, high toughness and heat resistance, and are important materials for national defense equipment, but they are also typical brittle and difficult-to-machine materials. To achieve high quality and low damage machining of the composite parts, grinding removal mechanism and subsurface damage are investigated in this paper. Firstly, the SPH simulation models for indentation and scratching of a single diamond grain are established. The effect of addition of graphene nanosheets on the crack expansion mechanism and subsurface damage is investigated. Then, the simulation models of different angles of graphene nanosheets are established to analyze the effect of graphene anisotropy on grinding process of composites. Finally, the grinding removal mechanism of the composites is investigated by analysing crack expansion and removal forms of the composites at different scratching velocities and depths. The results show that incorporation of graphene nanosheets can reduce subsurface damage of composites and provide a certain shielding effect on the cracks. The optimal effects for reducing subsurface damage and cracks are obtained when graphene nanosheets angle is 0°. As scratching depth increases, the material removal mode gradually changes from plastic removal to brittle removal, and subsurface damage and crack depths also increases. The increase in scratching velocity leads to a subsequent increase in material strain rate, which inhibits crack generation and reduces subsurface damage depth. The form of material removal and crack generation in scratching experiments is consistent with the simulation analysis when changing the scratching depth. Furthermore, the effect of graphene nanosheets on crack deflection corresponds with the simulation results. This study can provide an important theoretical basis for the grinding process of bionic layered graphene ceramic matrix composite parts.

show abstract

Analysis of the high-efficiency and low-damage abrasive processing mechanism for SiC based on the SPH simulation of single-grain indentation and scratching

Cited by 3 publications

References 27 publications

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

An Analysis of Edge Chipping in LiTaO3 Wafer Grinding Using a Scratch Test and FEA Simulation

Study on grinding removal mechanism and subsurface damage of bionic layered graphene ceramic matrix composites

Study on grinding removal mechanism and subsurface damage of bionic layered graphene ceramic matrix composites

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