Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies

Walter, Hans; Wittler, Olaf; Van Dijk, Marius; Huber, Saskia; Julia-Marie-Köszegi,; Schneider-Ramelow, Martin

doi:10.23919/empc55870.2023.10418283

2023 24th European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2023

DOI: 10.23919/empc55870.2023.10418283

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Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies

Hans Walter,

Olaf Wittler,

Marius Van Dijk

et al.

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Numerical simulation approach for consideration of ageing effects in PCB substrates by modifying viscoelastic materials properties

van Dijk,

Wittler,

Wagner

et al. 2024

Microelectronics Reliability

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Numerical simulation approach for consideration of ageing effects in PCB substrates by modifying viscoelastic materials properties

van Dijk,

Wittler,

Wagner

et al. 2024

Microelectronics Reliability

View full text Add to dashboard Cite

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Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies

Cited by 1 publication

References 7 publications

Numerical simulation approach for consideration of ageing effects in PCB substrates by modifying viscoelastic materials properties

Numerical simulation approach for consideration of ageing effects in PCB substrates by modifying viscoelastic materials properties

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