2015
DOI: 10.1007/s00542-015-2493-8
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Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

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Cited by 14 publications
(7 citation statements)
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“…Wand et al [ 6 ] chose to construct a three-dimensional finite element model (FEM) of an MLCC. They neglected the capacitor fillets due to the insignificant influence on the MLCC vibration and, as hundreds of dielectric layers are present in the capacitor structure, they simplified the model with fewer layers but similar vibration performance.…”
Section: Preventionmentioning
confidence: 99%
See 1 more Smart Citation
“…Wand et al [ 6 ] chose to construct a three-dimensional finite element model (FEM) of an MLCC. They neglected the capacitor fillets due to the insignificant influence on the MLCC vibration and, as hundreds of dielectric layers are present in the capacitor structure, they simplified the model with fewer layers but similar vibration performance.…”
Section: Preventionmentioning
confidence: 99%
“…The main advantages of the MLCCs are their small size and price [ 6 ]. Despite their small size, they have large capacitance and favorable electrical characteristics.…”
Section: Introductionmentioning
confidence: 99%
“…When the vibration of the MLCC contains frequency components that correspond to any of the natural frequencies of the circuit board that are within the audible frequency range (ie, 20–20 000 Hz), acoustic noise is generated from the resonances . Such acoustic noise is undesirable and several attempts have been made to reduce the vibrations that lead to this noise . However, it is still difficult to analyze and predict the vibration of an MLCC because little information is available about the material properties of the BT used in MLCCs.…”
Section: Introductionmentioning
confidence: 99%
“…2 Such acoustic noise is undesirable and several attempts have been made to reduce the vibrations that lead to this noise. [3][4][5] However, it is still difficult to analyze and predict the vibration of an MLCC because little information is available about the material properties of the BT used in MLCCs. Those BTs differ from pure BT because some additives (such as MgO, used to control the temperature dependency of the dielectric constant) are added to improve the electrical characteristics.…”
Section: Introductionmentioning
confidence: 99%
“…Laps et al showed that the lead frame capacitors provided low‐noise characteristics at low cost and with high robustness against board flexure . Wang et al analyzed the influence of solder shape on the vibration of MLCCs, and suggested an improved shape to reduce vibration and acoustic noise . Lin et al studied ways to enhance the piezoelectricity of MLCCs using a simple repoling process.…”
Section: Introductionmentioning
confidence: 99%