Analysis of the Micromachining Process of Dielectric and Metallic Substrates Immersed in Water with Femtosecond Pulses

Butkus, Simas; Alesenkov, Aleksandr; Paipulas, Domas; Gaižauskas, E.; Melninkaitis, Andrius; Kaškelytė, Dalia; Barkauskas, Martynas; Sirutkaitis, Valdas

doi:10.3390/mi6121471

Cited by 8 publications

(8 citation statements)

References 40 publications

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“…Increase the pulse fluence [12]; Use water assisted laser ablation [15] for more efficient drilling (a two-fold processing speed increase can be achieved if the need for double-sided ablation is removed); Use of bursts of laser pulses [16]; Work with shorter pulses [17]. We may expect for instance a seven-fold increase in the processing speed by using a 400 fs pulse duration [18].…”

Section: Discussionmentioning

confidence: 99%

“…However, at the prototyping phase where small numbers of devices need to be produced and tested, maskless laser writing can certainly be beneficial. Optimization of the processing speed can be easily achieved by either of the following pathways: Increase the pulse fluence [ 12 ]; Use water assisted laser ablation [ 15 ] for more efficient drilling (a two-fold processing speed increase can be achieved if the need for double-sided ablation is removed); Use of bursts of laser pulses [ 16 ]; Work with shorter pulses [ 17 ]. We may expect for instance a seven-fold increase in the processing speed by using a 400 fs pulse duration [ 18 ].…”

Section: Discussionmentioning

confidence: 99%

“…Use water assisted laser ablation [ 15 ] for more efficient drilling (a two-fold processing speed increase can be achieved if the need for double-sided ablation is removed);…”

Section: Discussionmentioning

confidence: 99%

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Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device

et al. 2021

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Thermal management is one of the main challenges in the most demanding detector technologies and for the future of microelectronics. Microfluidic cooling has been proposed as a fully integrated solution to the heat dissipation problem in modern high-power microelectronics. Traditional manufacturing of silicon-based microfluidic devices involves advanced, mask-based lithography techniques for surface patterning. The limited availability of such facilities prevents widespread development and use. We demonstrate the relevance of maskless laser writing to advantageously replace lithographic steps and provide a more prototype-friendly process flow. We use a 20 W infrared laser with a pulse duration of 50 ps to engrave and drill a 525 μm-thick silicon wafer. Anodic bonding to a SiO2 wafer is used to encapsulate the patterned surface. Mechanically clamped inlet/outlet connectors complete the fully operational microcooling device. The functionality of the device has been validated by thermofluidic measurements. Our approach constitutes a modular microfabrication solution that should facilitate prototyping studies of new concepts for co-designed electronics and microfluidics.

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Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

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Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device

et al. 2021

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“…In this study, the main focus was to understand and explain the unique data distributions for the process of cutting 1-mm thick, soda-lime glass samples and varying several laser parameters. More technical investigations regarding cutting throughput for the micromachining technique, the detailed experimental parameter influence on the process, and the micromachining quality, as well as various examples, are found in [40][41][42]. Therefore, this section will be divided into two parts, one explaining the experimental setup for cutting the samples as well as for gathering the data, and the second regarding aspects of numerical modelling of the beam propagation within the water layer and the formation of craters.…”

Section: Methodsmentioning

confidence: 99%

Femtosecond Beam Transformation Effects in Water, Enabling Increased Throughput Micromachining in Transparent Materials

et al. 2019

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Femtosecond lasers are widely applied in scientific and industrial fields. Recent trends in the laser market show decreasing prices for femtosecond units, which will ultimately lead to the opening of new markets that were inaccessible in the past due to the high costs of such systems. To this end, new techniques that enable micromachining of materials with increased efficiency are interesting. In this article, we demonstrate a technique that may be used for cutting and drilling various materials. By placing a layer of water on top of the samples and loosely focusing laser light on the surface, it was found that the micromachining throughput is increased by up to 10-fold as compared with micromachining without the water layer (conventional focusing in air), however, the main reasons for the increase in fabrication efficiency have not been fully understood until now. By modelling the propagation of the femtosecond pulses by means of the nonlinear modified Schrodinger equation through the water layer, we show that the increased throughput is attributed to the changing of the Gaussian intensity profile. In addition, we confirm these findings by numerically modelling the ablated crater formation.

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“…Due to the high precision and low thermal damage offered by ultrashort pulse micromachining, femtosecond laser systems are widely applied in both industrial and scientific fields [ 1 ]. Though the advantages of such systems (if compared to longer pulse or non-laser-based micromachining [ 2 ]) are unquestioned, the constantly advancing industry requires higher micromachining throughput, better end-quality and higher versatility in terms of machinable materials [ 3 , 4 , 5 ]. To accompany the needs of the industry, a trend towards high average power (>100 W) femtosecond laser systems development and utilization for micromachining has become apparent [ 6 , 7 ].…”

Section: Introductionmentioning

confidence: 99%

Micromachining of Invar Foils with GHz, MHz and kHz Femtosecond Burst Modes

et al. 2020

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In this work, a burst mode laser is used for micromachining of 20 µm–250 µm thick Invar (Fe64/Ni36) foils. Holes were drilled by firing multiple pulses transversely onto the sample without moving the beam (percussion drilling). The utilized laser system generates a burst of a controllable number of pulses (at 1030 nm) with tunable pulse-to-pulse time spacing ranging from 200 ps to 16 ns. The sub-pulses within the burst have equal amplitudes and a constant duration of 300 fs that do not change regardless of the spacing in time between them. In such a way, the laser generates GHz to MHz repetition rate pulse bursts with a burst repetition rate ranging from 100 kHz to a single shot. Drilling of the material is compared with the non-burst mode of kHz repetition rate. In addition, we analyze the drilling speed and the resulting dependence of the quality of the holes on the number of pulses per burst as well as the average laser power to find the optimal micromachining parameters for percussion drilling. We demonstrate that the micromachining throughput can be of an order of magnitude higher when using the burst mode as compared to the best results of the conventional kHz case; however, excess thermal damage was also evident in some cases.

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Analysis of the Micromachining Process of Dielectric and Metallic Substrates Immersed in Water with Femtosecond Pulses

Cited by 8 publications

References 40 publications

Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device

Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device

Femtosecond Beam Transformation Effects in Water, Enabling Increased Throughput Micromachining in Transparent Materials

Micromachining of Invar Foils with GHz, MHz and kHz Femtosecond Burst Modes

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