Oxygen precipitation properties in the as‐grown defect‐free region of nitrogen‐doped Czochralski silicon (Cz‐Si) single crystals with very low oxygen concentrations ([Oi]) are investigated. At [Oi] values of 4.6–5.9 × 1017 atoms cm−3, oxide precipitates with a high density of 109 cm−3 are generated owing to the enhancement in oxygen precipitation by nitrogen‐doping. In contrast, at [Oi] values of 1.3–2.6 × 1017 atoms cm−3, no oxide precipitates are observed even though the crystals are nitrogen‐doped. Oxygen precipitation in the as‐grown defect‐free region is analyzed based on a thermodynamic model, in which some embryos are assumed to exist in nitrogen‐doped Cz‐Si crystals at high temperatures of crystal growth, and they grow as oxide precipitates during a subsequent cooling process. The analysis of oxygen precipitation indicates that, at [Oi] values below 3 × 1017 atoms cm−3, the radii of oxide precipitates included in the as‐grown Cz‐Si crystals remain small owing to a low growth onset temperature; therefore, oxide precipitates cannot be detected after heat treatment for wafer evaluation. These findings suggest that nitrogen‐doped Cz‐Si crystals with [Oi] values below 3 × 1017 atoms cm−3 are potential materials for power devices, such as insulated gate bipolar transistors.