Analysis Of The Underpotential Deposition Of Cadmium On Copper

Kowalik, Remigiusz

doi:10.1515/amm-2015-0284

Cited by 5 publications

(1 citation statement)

References 19 publications

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“…The first one deals with the measurement of charge associated with the deposition or removal of a chemisorbed monolayer of species. For the noble metals, it is usually hydrogen or oxygen, while metal underpotential deposition (UPD), assuming monolayer deposition, can be applied for the larger group of metals, including Cu [5,[8][9][10][11][12][13]. Another method for evaluating ES r is based on the measurement of the electrical double-layer capacitance of the electrode.…”

Section: Introductionmentioning

confidence: 99%

On the Electrochemically Active Surface Area Determination of Electrodeposited Porous Cu 3D Nanostructures

Serapinienė,

Gudavičiūtė,

Tutlienė

et al. 2023

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Porous 3D Cu layers with the following average parameters: thickness ~35 µm, pore density ~4.0 × 106 cm−2, and pore sizes ~25 µm were electrodeposited from an acidic sulphate electrolyte, and the suitability of different electrochemically active surface area determination methods for characterising these electrodes was assessed. Structural characterisation of the samples was conducted using SEM and an optical profiler, while electrochemical measurements were performed using cyclic voltammetry and electrochemical impedance spectroscopy. The evaluation of electrochemically active surface area involved the underpotential deposition of Tl and Pb monolayers as well as double-layer capacitance measurements. The results obtained indicate that both methods yield similar results for non-porous Cu electrodes. However, for Cu 3D nanostructures, the evaluation mode significantly influences the results. Double-layer capacitance measurements show significantly higher values for the electrochemically active surface area compared to the underpotential deposition (UPD) technique. The complex spatial structure of the Cu 3D layer hinders the formation of a continuous monolayer during the UPD process, which is the principal reason for the observed differences.

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Section: Introductionmentioning

confidence: 99%

On the Electrochemically Active Surface Area Determination of Electrodeposited Porous Cu 3D Nanostructures

Serapinienė,

Gudavičiūtė,

Tutlienė

et al. 2023

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A Modulation QCM Applied to Copper Electrodeposition and Stripping

et al. 2021

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A fast electrochemical quartz crystal microbalance with dissipation monitoring (EQCMÀ D) was applied to copper electrodeposition and subsequent stripping. Accumulation brings the frequency noise down to the mHz range, corresponding to 0.1 % of a monolayer. With this precision, the apparent mass transfer rate as determined from the time-derivative of the frequency shift can be directly compared to the current. Small but systematic deviations between the two can be attributed to nanoscale roughness. In the voltage range of underpotential deposition (UPD), the apparent mass transfer rate shows peaks and shoulders. The plating additive benzotriazole (BTA) leaves the magnitude of electrogravimetric signals unchanged, but shifts the UPD onset potential. The additive thiourea (TU) promotes UPD and strongly increases the bandwidth.

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