Analysis of thermal stresses in redistribution layer of WLP with different arrangement of interconnections

Zhu, Chunsheng; Ning, Wenguo; Ye, Jiaotuo; Xu, Gaowei; Luo, Le

doi:10.1109/icept.2013.6756511

Cited by 4 publications

(2 citation statements)

References 7 publications

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“…The warpage degree relates to the thickness of BCB layer and wafer size. According to References 12‐14, the larger layer thickness and larger size, the more severe the warpage degree. In our process, we also noticed the wafer warpage of the 4′ inches wafer we used after three BCB layer was formed.…”

Section: Resultsmentioning

confidence: 99%

Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss

Zhang

et al. 2020

Micro & Optical Tech Letters

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In this paper, a copper/benzocyclotene thin film based microstrip bandpass filter featured by a thick dielectric layer is presented. For thickening dielectric layer, a 30 μm-deep micromachined groove with embedded benzocyclotene polymer is fabricated on the surface of silicon substrate. Mechanical polishing is utilized to planarize the benzocyclotene polymer embedded in the groove. Atomic Force Microscopy is used to characterize the surface roughness of benzocyclobutene (BCB) polymer film before and after polishing. With two additional BCB layer, a total thickness of 75.4 μm dielectric layer is realized, and the insertion loss of the filter can be reduced by 1.34 dB theoretically. The measured insertion loss of fabricated filter is −2.2 dB, which can be further reduced via tighter control of device parameters.

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Section: Resultsmentioning

confidence: 99%

Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss

Zhang

et al. 2020

Micro & Optical Tech Letters

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“…Wafer warpage research on single IC today is rather fruitful [1][2][3][4][5]. In fact, warpage issues involved not only that of single IC wafer but also multiple wafers with bonding [6] [7].…”

Section: Introductionmentioning

confidence: 99%

Warpage and stress optimization of wafer-level package of MEMS with glass frit bonding

Zhu

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

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Warpage issue of wafer level package (WLP) has caught the attention of WLP industry. This paper aims at the warpage characteristics and optimization of the WLP (consisting of silicon MEMS wafer and silicon cover wafer) with glass frit bonding. Finite-element method (FEM) was used to study the warpage and stress optimization of the Si-Si bonding WLP. Some factors which affect WLP warpage, such as CTE (coefficient of thermal expansion) and Young's modulus of glass frit, ring thickness & width of glass frit and bonding temperature etc. were optimized. The stress of WLP was also calculated and the reliability level of the MEMS device was estimated. It turned out that CTE and Young modulus of glass frit are the key parameters for decreasing WLP warpage and stress and promoting the MEMS WLP. Ring width of glass frit and the thickness of silicon cover plate wafer have little impacts on WLP stress and warpage. With the optimized parameters taken into account, the stress in MEMS WLP falls down. Those optimization results have been put into actual WLP manufacture. Keywords-warpage; stress; optimization; glass frit; wafer level package (WLP); finite-element method (FEM); MOS (multi-beam optical sensor) deformation measurement; micro electro mechanical systems (MEMS)

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Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging

Gao

et al. 2022

IEEE Trans. Compon., Packag. Manufact. Technol.

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Analysis of thermal stresses in redistribution layer of WLP with different arrangement of interconnections

Cited by 4 publications

References 7 publications

Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss

Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss

Warpage and stress optimization of wafer-level package of MEMS with glass frit bonding

Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging

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