Analysis of vibration causes of large aperture wafer under vertical support

Yang, Ying; Shen, Yuhang; Lv, Wujun; Zhang, Linghua; Han, Sen; Han, Manlin; Guo, Jingming; Gong, Chenxi

doi:10.1117/12.2686769

Optical Metrology and Inspection for Industrial Applications X 2023

DOI: 10.1117/12.2686769

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Analysis of vibration causes of large aperture wafer under vertical support

Ying Yang,

Yuhang Shen,

Wujun Lv

et al.

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2024

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Cited by 1 publication

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Surface profile measurement and parameter analysis of silicon wafers in the upright state

Yang,

Han,

Zhang

et al. 2024

Appl. Opt.

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A novel approach, to the best of our knowledge, is presented for assessing silicon wafer surface profiles using an interferometer and vertically rotatable wafer holder. This approach significantly enhances precision and reduces costs, and outperforms traditional techniques in measurement consistency and accuracy. It effectively reduces sample distortion and positional shifts owing to the removal and reinstallation of the wafers. Using this method, a global backsurface-referenced ideal range of 0.385 µm, warp of 0.193 µm, and other parameters were obtained, demonstrating its practicality in efficiently capturing key surface profile metrics for silicon wafers. This innovation promises substantial improvements in high-volume wafer surface profile testing, overcoming prevalent technological challenges in this industry.

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Surface profile measurement and parameter analysis of silicon wafers in the upright state

Yang,

Han,

Zhang

et al. 2024

Appl. Opt.

View full text Add to dashboard Cite

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Analysis of vibration causes of large aperture wafer under vertical support

Cited by 1 publication

References 9 publications

Surface profile measurement and parameter analysis of silicon wafers in the upright state

Surface profile measurement and parameter analysis of silicon wafers in the upright state

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