A precipitation study was carried out during the isothermal aging at 850 °C for .%Cu alloys. The experimental, Calphad, and Kinetic/Precipitation calculated results indicated that the Cu-addition to the ternary alloy promoted a higher volume fraction of β´precipitates, which caused a better aging response for the Cu-containing alloys. The coarsening resistance was the highest for the 2.5 at. % Cu-containing alloy, compared to the ternary alloy because of its lower interfacial free energy, 0.009 Jm -2 , between the precipitate and the matrix. The Cu alloying element was located mainly in the β´ precipitate according to its expected thermodynamic behavior, and it caused an atomic relation of Ni to Al close to that of NiAl intermetallic compound for the β´phase. A content of 5 at. % Cu in the ternary alloy promoted higher interfacial energy, 0.04 Jm-2 , and thus the fastest coarsening process.