Analytical and numerical calculation of surface temperature and thermal constriction resistance in transient dynamic strip contact

Abstract

In this paper, the problem of transient heat transfer in sliding contact is studied analytically and numerically.The heat source is represented as a uniform heat strip moving over a half-space with and without cooling outside the contact zone. The finite element method, implemented using a commercial code, was used in numerically solving this problem. An analytical solution taken from the literature was adapted to obtain the presented model and used to check the capabilities of the commercial code. After the validation of the resolution method, the work was completed by studying the influence of the Peclet number (source speed) and the Biot number (presence of cooling) on the temporal and spatial evolution of the surface temperature of the half-space. Finally, the transient constriction function is estimated and analyzed for the presented test cases. Correlations were also derived to (i) evaluate the time interval within which the steady state is reached, and (ii) estimate the constriction parameter as a function of Peclet and Biot numbers in the steady state case.

Modelamiento del proceso de desgaste de un tribómetro pin-disco: Flash temperature y mecanismos de disipación

“…Cuando el Pin se desliza sobre el Disco, el resultado inevitable de la fricción es la liberación de calor. A altas velocidades de deslizamiento se libera una gran cantidad de energía [17]. Casi todo el calor liberado en el proceso de fricción en un deslizamiento en seco entre sólidos es generado sobre la interfaz de contacto y disipado en el interior de los sólidos a través de las rugosidades en contacto [21].…”

“…Se han propuesto ecuaciones constitutivas donde se describen los diferentes mecanismos de desgaste en función de la energía disipada [16], [17]. También se tienen estudios donde se presentan correlaciones entre el área real de contacto con la energía generada y su posterior disipación dentro de los sólidos en contacto [18]- [20].…”

Thermal impedance estimations by semi-derivatives and semi-integrals: 1-D semi-infinite cases

“…Although this is a very old subject [1,2 ], it remains scientifically important and at the microscopic scale, difficult to master in some configurations [3], such as transitional arrangements and the presence of heat convection, cooling of electronic devices both at the package and system level, and cooling of power semi-conductors using heat sinks [4]. In many cases, the time-depended behaviour relevant to the thermal impedance is of primary importance [7][8][9][10]. In many cases, the time-depended behaviour relevant to the thermal impedance is of primary importance [7][8][9][10].…”

Modeling and analysis of transient temperature field in finite thickness plate under symmetrically located moving heat sources

“…When convection takes place on the surface of the semi-infinite model, the analytical solution provided by the literature 13 takes the form…”

“…Tseng et al 9 provided the thermal stress solutions for the semi-infinite model, and they are applied in some researches of disk brakes. [10][11][12] Aderghal et al 13 studied the influences of moving speed of the heat source and the cooling effects on the temperature field numerically. Some researches considered the plate thickness in given structures and studied the temperature of the plate by simulation or experiments.…”